A laser etching process for saw blade cutting structure

A technology of laser etching and sawing, which is applied in the direction of metal sawing equipment, laser welding equipment, sawing machine knives, etc., can solve the problems of inability to cut quickly, corrosion resistance, thick blade, etc., and achieve free and flexible blade thickness. Good sharpness and hardness

Inactive Publication Date: 2018-04-13
蔡锦霞
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] With the continuous improvement of mechanical processing technology, the requirements for the processing tools used are also continuously improved. Not only the cutting knife is required to be sharp, the cutting speed, the degree of cutting, but also the cutting is required to be neat. The requirements for production efficiency, lower production costs, and highly intelligent automatic cutting functions are also increasing. Saw knives, as a kind of knives, are widely used in daily life. Saw knives generally include blades and serrations. However, At present, many saw blades have the same thickness as the saw blade. The blade is too thick to cut quickly, and too thin to be corrosion-resistant and tough.

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  • A laser etching process for saw blade cutting structure
  • A laser etching process for saw blade cutting structure

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specific Embodiment

[0055] The user uses a saw blade cutting structure and its laser etching process of the present invention, the laser 6 etches the saw blade body 1, the laser 6 can etch a free-form blade, and the laser beam 7 traces the laser beam 7 during the laser etching process The way, routing sequence, etching thickness, and discharge current are different. Therefore, the sharpness and toughness and hardness of the saw blade body 1 are different accordingly. The shape, profile or size of the etched object 6 is etched, and the laser etching processing method includes the following steps: 1) Generate laser etching data according to the shape, size or profile of the saw blade body 1, and the laser etching data includes finishing data and Rough processing data; 2) Use the laser 6 to perform profiling etching on the saw blade body 1 according to the laser etching data to generate the shape of the tool; 3) After profiling, perform rough etching; 4) Perform rough machining on the surface of the ...

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Abstract

The invention discloses a cutting structure of a sawing cutter and a laser etching process thereof. The cutting structure of the sawing cutter comprises a sawing cutter body which consists of a cutter body and a blade, wherein the cutter body comprises a first blade and a second blade; the first blade comprises a common blade; the second blade which is connected with the first blade comprises a sawtooth blade; the cutter body and the blade are different in thickness and hardness; the sawing cutter body is processed through the laser etching process. According to the cutting structure of the sawing cutter and the laser etching process thereof, the process is simple; with the adoption of the laser etching, the blade and the cutter body with different shape can be etched, the thickness of the blade and the cutter body can be freely and flexibly varied, and the etched cutter body is high in hardness, high in toughness and sharp in the blade.

Description

technical field [0001] The invention relates to the field of knives, in particular to a laser etching process for a saw blade cutting structure. Background technique [0002] Another advantage of laser etching is that it is not affected by the hardness of the component material. Laser etching has nothing to do with the hardness of the material. Etching can change the shape of the material, but will not Change any property of the material, the edge of the blade is thinner than the rest of the blade, if using stamping it can be used to machine parts of different thicknesses but requires high tonnage of pressure to extrude the metal to form the thinner areas which will make those areas of the metal thinner A so-called work hardening effect occurs when the material is made harder, so that parts processed in this way develop different properties in regions of different thicknesses. In contrast, laser etching can process parts of different thicknesses without affecting the hardne...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23D61/00B23D65/00B23K26/362
CPCB23D61/00B23D65/00B23K26/361
Inventor 蔡锦霞
Owner 蔡锦霞
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