Anisotropic conductive film and method for producing same
An anisotropic, conductive film technology, applied in the direction of conductive connection, conductive adhesive, printed circuit manufacturing, etc., can solve the problems of disordered arrangement of conductive particles, inability to obtain anisotropic conductive connection characteristics, etc., and achieve good adhesion , improve the effect of recovery
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[0144]
[0145] prepared by photopolymerization in one step figure 1 ( Figure 5B ) will be described as an example of an anisotropic conductive film. This preparation example has the following steps (A) to (D).
[0146] (Process (A))
[0147] First, use an original plate (not shown) formed with minute unevenness, such as figure 2 As shown, a photopolymerizable resin layer 31 having minute unevenness 2c on one surface is formed. This formation can be performed using a known method. In addition, the photopolymerizable resin layer 31 can be peeled off from the original plate, and supported on a release film for the next step as needed, but it is preferable to support the photopolymerizable resin layer 31 on the original plate from the viewpoint of making it difficult to damage the fine unevenness in the subsequent process. The state of the polymeric resin layer 31 is passed to the next process.
[0148] (Process (B))
[0149] Such as image 3 As shown, conductive par...
Embodiment 1~6
[0233] Embodiment 1~6, comparative example 1
[0234] Conductive particles were arranged according to the operation of Example 1 of Japanese Patent No. 4789738, and a double-layer structure in which the first connection layer and the second connection layer were laminated was prepared according to the blending (parts by mass) shown in Table 1. Anisotropic conductive film.
[0235] (1st connection layer)
[0236] Specifically, first, the acrylate compound, the photoradical polymerization initiator, and the like were mixed liquid with ethyl acetate or toluene so that the solid content would be 50% by mass. This mixed solution was coated on an aluminum plate-shaped original plate capable of imparting the occupied area of the micro-concave-convex structure and the average depth of the micro-concave-convex structure shown in Table 1 to the first connection layer, so that the dry thickness was 3 μm, and in an oven at 80° C. By drying for 5 minutes, a radical photopolymerizable r...
Embodiment 7
[0264] 2000mJ / cm cumulative light intensity when forming the first connection layer 2 Except having irradiated ultraviolet rays, it carried out similarly to Example 1, and produced the anisotropic conductive film. From the side of the first connection layer of the anisotropic conductive film, the cumulative light intensity is 2000mJ / cm 2 By irradiating ultraviolet rays with a wavelength of 365 nm, the anisotropic conductive film of Example 7 in which ultraviolet rays were irradiated from both surfaces of the first connection layer was obtained. Using this anisotropic conductive film, a connection structure sample body was prepared and evaluated in the same manner as the anisotropic conductive film of Example 1, and the result that there was no problem in practical use was obtained to be substantially the same, but the conduction reliability was further improved. Tendency to be improved.
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