Solder composition and electronic substrate using the same
A technology of composition and solder, applied in the direction of welding/cutting media/materials, assembling printed circuits with electric components, welding equipment, etc., can solve the problems of corrosion, dripping, solder balls and other problems of welding parts, and achieve the purpose of inhibiting outflow and corrosion , excellent wettability effect
Active Publication Date: 2020-04-07
TAMURA KK
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- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0004] However, when an activator such as an organic acid is added, the wettability of the solder tends to increase, but there is also a problem that corrosion easily occurs on the soldered part.
In addition, due to the micronization of the solder powder, there is also a problem that solder balls and dripping due to heating are likely to occur.
As mentioned above, with the micronization of solder powder, there are various problems, and there is no solder composition that can satisfy all these requirements
Method used
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Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0108] Rosin-based resin 36% by mass, thixotropic agent 6% by mass, solvent A 30% by mass, solvent B 14.9% by mass, activator A 0.1% by mass, activator D 0.5% by mass, activator E 0.5% by mass, activator 6% by mass of F, 3% by mass of activator G, 1% by mass of activator H, and 2% by mass of antioxidant were put into a container and mixed using a planetary mixer to obtain a flux composition.
[0109] Then, 11% by mass of the obtained flux composition and 89% by mass of the solder powder (100% by mass in total) were put into a container and mixed using a planetary mixer to prepare a solder composition.
Embodiment 2～5
[0111] A solder composition was obtained in the same manner as in Example 1 except that various materials were mixed in the composition shown in Table 1.
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Abstract
The present invention provides a solder composition, which contains a flux composition and (E) solder powder. The flux composition includes (A) rosin resin, (B) activator, (C) thixotropic agent and (D) A solvent in which the component (B) contains (B1) a polycarboxylic acid having a melting point of 160° C. or more and 220° C. or less and having three or more carboxyl groups in one molecule.
Description
technical field [0001] The present invention relates to a solder composition and an electronic substrate using the solder composition. Background technique [0002] In recent years, as electronic devices have become lighter, thinner and shorter, the miniaturization of printed wiring boards has progressed, and the miniaturization of mounting components mounted on printed circuit boards has also progressed. In order to join such fine components with a fine pitch, it is required to pulverize the solder powder (for example, the average particle diameter is 20 μm or less). [0003] However, if the average particle size is small, the specific surface area increases, and the amount of oxides generated on the surface of the solder powder also increases accordingly. In order to melt and remove oxides generated on the surface of solder powder, a solder composition containing a flux component having a high reducing power is required. Publication No. 2006-110580). [0004] However, w...
Claims
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IPC IPC(8): B23K35/362H05K3/34
CPCB23K35/3613B23K35/362H05K3/3485H05K3/3489
Inventor 中路将一石垣幸一中村步美
Owner TAMURA KK