Facet film-plating clamp for semiconductor laser chip

Abstract

The invention provides a novel facet film-plating clamp for a semiconductor laser chip. The clamp has advantages of stable clamping, simple structure, convenient operation, and easy processing; and film plating can be carried out products in batches and the plated film quality can be improved effectively. The clamp comprises a flat-panel U-shaped frame assembly and a choke plug assembly arranged at a U-shaped opening end; and a plurality of bars are stacked successively from a U-shaped closing end to the U-shaped opening end in a planar closing area encircled by the flat-panel U-shaped frame assembly and the choke plug assembly. The inner side width of a U-shaped middle plate of the flat-panel U-shaped frame assembly is larger than inner side widths of a lower plate and a U-shaped upper plate, so that side cavity parts at the two ends of the multiple bars are supported on a rail surface reserved by the lower plate, are pressed and covered by a rail surface reserved by the U-shaped upper plate, and are limited by the U-shaped middle plate in a horizontal direction. The choke plug assembly applies tightening pressures on the multiple bars from the U-shaped opening end to the U-shaped closing end.

Description

technical field [0001] The invention relates to a semiconductor laser chip cavity surface coating fixture. Background technique [0002] High-power semiconductor lasers have the advantages of all-solid-state, small size, light weight, long life, high efficiency, high reliability, and high metal-to-semiconductor laser absorption, so they are widely used in pumping sources of solid-state lasers, laser processing, and laser cutting. , precision detection and measurement, communication and information processing, medical treatment and beauty, military and other aspects, and has caused revolutionary breakthroughs in many fields, with huge market demand and development potential. [0003] Cleavage plane of resonator is an important part of semiconductor laser, and it has an important influence on the reliability of the device. Generally, the reflectivity of the natural cleavage plane of GaAs laser is about 32%, which is not ideal, and the natural cleavage plane is easy to oxidize...

AI Technical Summary

Problems solved by technology

[0006] 1. The complex structure of the fixture is not conducive to processing and cleaning and maintenance after use, resulting in rapid decline in accuracy and shortened service life

[0007] 2. At present, many fixtures can only be coated on one side, and double-sided coating needs to be disassembled and assembled twice. Repeated operations will cause great damage to the chip, and the large angle of the fixed area will cause shadows;

[0008] 3. The structure of the chip is complex, the tolerance is small, and the requirements for personnel skills are high. If the stacking is not smooth during the operation process, it will easily cause contamination or damage to the cavity surface, resulting in low work efficiency, low yield, and damage to the product;

[0009] 4. Unreasonable structural design of individual fixtures, chip clamping is not firm, slides or falls, which will cause damage;

[0010] 5. The fixture structure is complex, there are many parts, the precision of the fixture is high, the processing yield is low, and the processing cost is high;

[0011] 6. There are many fixture assemblies, fewer places to store chips, less amount of coating at one time, and high production costs; the fixture structure is complex and difficult to clean, and it is easy to contaminate the end face of the chip during the coating process

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