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Sn-Zn-Bi-series lead-free welding flux alloy and preparation method thereof

A lead-free solder alloy, solder powder technology, applied in welding equipment, metal processing equipment, welding/cutting medium/material, etc., can solve the problem of low solder joint strength

Active Publication Date: 2016-10-26
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the practical problems of the above-mentioned prior art, the purpose of the present invention is to provide a kind of solder joint strength that has better solder joint strength for existing Sn-Zn-Bi series solder alloys in soldering reliability and low solder joint strength. , and lead-free solder alloys with better oxidation resistance. It should be noted that the compositions mentioned below are expressed in mass percent

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] The components added during preparation are as follows by mass percentage: 8% for pure Zn, 3% for pure Bi, 0.985% for pure Ti, 0.02% for pure aluminum, and 0.1% for Al-15Ti-5B master alloy. The preparation method of the lead-free solder alloy is to obtain the solder alloy, wherein the temperature in step (3) is set to 750° C. and kept for 30 minutes. Each metallic element of the alloy that above-mentioned proportioning obtains is as follows by mass percentage:

[0028] Zn: 8%

[0029] Bi: 3%

[0030] Al: 0.1%

[0031] Ti: 1%

[0032] B: 0.005%

[0033] Sn: margin.

Embodiment 2

[0035] The components added during preparation are as follows by mass percentage: 6% for pure Zn, 2% for pure Bi, 0.4925% for pure Ti, 0.01% for pure aluminum, 0.05% for Al-15Ti-5B master alloy. (3) Set the step temperature to 700°C and keep it warm for 20 minutes. All the other steps are with embodiment 1, and each metal element of the alloy that above-mentioned proportioning obtains is as follows by mass percentage:

[0036] Zn: 6%

[0037] Bi: 2%

[0038] Al: 0.05%

[0039] Ti: 0.5%

[0040] B: 0.0025%

[0041] Sn: margin.

Embodiment 3

[0043] The components added during preparation are as follows in terms of mass percentage: 8% pure Zn, 1% pure Bi, 0.197% pure Ti, 0.004% pure aluminum, 0.02% Al-15Ti-5B master alloy, alloy preparation and melting (3) Set the step temperature to 650°C and keep it warm for 5 minutes. All the other steps are with embodiment 2, and each metal element of the alloy that above-mentioned proportioning obtains is as follows by mass percentage:

[0044] Zn: 8%

[0045] Bi: 1%

[0046] Al: 0.02%

[0047] Ti: 0.2%

[0048] B: 0.001%

[0049] Sn: margin.

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Abstract

The invention provides Sn-Zn-Bi-series lead-free welding flux alloy and a preparation method thereof. The Sn-Zn-Bi-series lead-free welding flux alloy consists of the following elements in percentage by mass: 6-8% of Zn, 1-3% of Bi, 0.2-1% of Ti, 0.02-0.1% of Al, 0.001-0.005% of B and the balance Sn. Compared with the prior art, the Sn-Zn-Bi-series lead-free welding flux alloy has relatively good welding spot bonding strength and also has relatively good resistance to oxidation and wettability.

Description

Technical field: [0001] The invention belongs to the field of metal materials, and in particular relates to a Sn-Zn-Bi series lead-free solder alloy and a preparation method thereof. Background technique: [0002] Sn-Pb solder has been used in the electronics industry for quite a long time. Due to its low melting point, high cost performance and easy availability, it has become the most important low-temperature solder system and is widely used in non-ferrous metals, Welding of food containers, construction, machinery and piping installations, etc. However, with the advent of the information age, electronic products emerge in an endless stream. While these electronic products benefit mankind, the lead contained in them is also increasingly polluting the ecological environment and human health. The promulgation of the WEEE directive and the RoHS directive symbolizes that lead-free solder has officially become the mainstream of the times. According to the requirements of the ...

Claims

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Application Information

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IPC IPC(8): B23K35/26B23K35/40
CPCB23K35/262B23K35/40
Inventor 李冲张新刘永长余黎明李会军
Owner TIANJIN UNIV
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