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An LED encapsulating material, a preparing method thereof and application of the material

A technology of LED packaging and packaging materials, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of fluidity, reliability, heat insulation and light performance attenuation, and achieve simple and efficient application, excellent transmittance and refractive index , Excellent heat resistance

Inactive Publication Date: 2016-10-26
NINGBO XIAYUAN TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] There are still many problems in the existing light-emitting diode packaging materials in terms of material fluidity, reliability, heat insulation, and light performance attenuation. It is urgent to develop a new type of packaging material for light-emitting diodes.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] An LED packaging material in this embodiment is prepared from the following raw materials: vinyl compound A, cycloethylmethylsiloxane-carbonyl-platinum complex, 3,5-dimethyl-1-hexyne-3- Alcohol, hydride B, phenylvinylmethylsilane, the chemical structural formula of vinyl compound A is The chemical structure of hydride B is Its 0≤x, y, u, v≤2000, Me represents methyl CH 3 -, Ph stands for phenyl C 6 h 5 -.

[0039] The chemical structural formula of the above packaging material is: Among them, 0≤x, y, u, v≤2000, Me represents methyl CH 3 -, Ph stands for phenyl C 6 h 5 -, the encapsulation material can be stored for at least 6 months at a temperature below 4°C.

[0040] method embodiment

[0041] The above-mentioned product examples can be prepared according to the following preparation method. A method for preparing an LED encapsulation material includes the following steps:

[0042]Step S1: Add 43.25g of vinyl compound A to a round bottom flask, then add 8...

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PUM

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Abstract

The invention relates to an LED encapsulating material. The material is prepared from a vinyl compound A, a cyclohexyl methylsiloxane-carbonyl-platinum composite, 3,5-dimethyl-1-hexyn-3-ol, a hydride B and phenyl vinyl methylsilane. The chemical structural formula of the vinyl compound A is shown in the specification. The chemical structural formula of the hydride B is shown in the specification. The chemical structural formula of the material is shown in the specification, wherein x, y, u and v are not more than 2000 and not less than 0, Me represents methyl CH<3>- and Ph represents phenyl C<6>H<5>-. Compared with the prior art, the material has advantages of excellent transmissivity and refractive indexes in each waveband, excellent heat resistance, low optical performance degradation, good fluidity before heating and curing, convenience for effective encapsulating for light emitting diodes, a simple preparing method, and simple, convenient and efficient applications.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to an LED packaging material and a preparation method and application thereof. Background technique [0002] High-brightness light-emitting diodes (LEDs) based on gallium nitride semiconductor materials are expected to replace traditional incandescent and fluorescent lamps as the technology matures and the cost per illuminance decreases. In order to reduce the cost per unit illuminance of light-emitting diodes, high-refractive-index packaging materials can extract more emitted light from the surface of GaN. In the rate region, all internal reflection effects exist. The existence of a refractive index mismatch between the encapsulating material and the luminescent substance leads to additional light loss. The refractive index of most packaging materials is 1.5-1.7. Although this can increase the light output by 5%-10%, the packaging materials used in light-emitti...

Claims

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Application Information

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IPC IPC(8): C08G77/44C08G77/20C08G77/12H01L33/56
CPCC08G77/44C08G77/12C08G77/20H01L33/56
Inventor 魏亮
Owner NINGBO XIAYUAN TECH
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