Layer-to-layer registration control method for inner layers of HDI (High Density Interconnector) board

A control method and alignment technology, applied in multilayer circuit manufacturing, printed circuit manufacturing, electrical components, etc., can solve problems such as high rejection rate, large inner layers of HDI boards, and inability to meet HDI board production requirements, etc. The effect of low rejection rate, high alignment between inner layers and reasonable and novel design

Inactive Publication Date: 2016-10-26
奥士康精密电路(惠州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Production of HDI boards through the existing technical process, the inner layer of the finished HDI board is relatively large, and the scrap rate is high, which cannot meet the production needs of HDI boards

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] The present invention is a manufacturing method of a method for controlling alignment between inner layers of an HDI board, which is made by the following steps:

[0035] (1) Plate opening: Cut the substrate into an applicable size to facilitate the subsequent manufacturing process; during the process of cutting the substrate or after cutting, the substrate is heated and processed by the drying plate operation;

[0036] (2) Inner layer: Drill holes on the cut substrate to facilitate subsequent alignment and maintenance, and use film etching to make inner layer lines and patterns;

[0037] (3) AOI: Place the substrate prepared in step (2) on the optical inspection equipment, and perform defect detection on the substrate through the optical inspection equipment, recycle the unqualified substrate, and send the qualified substrate to the next step ;

[0038] (4) Browning: carry out browning treatment on the qualified substrates detected in step (3);

[0039] (5) Laminatio...

Embodiment 2

[0044] The difference between this embodiment and Embodiment 1 is that in the step (2), the circuit board grinder is not used to grind the substrate, but a chemical method is used for pretreatment. Before the browning operation in the step (4), the browning equipment needs to measure the degree of ion pollution, and carry out void detection on the edge of the back plate of the browning equipment.

Embodiment 3

[0046] The difference between this embodiment and Embodiment 1 and Embodiment 2 is that: the X-RAY target drilling operation is performed on the laminated substrate after the step (5) is completed, and the X-RAY target drilling operation uses the line compensation method, and Measure the expansion and contraction data of the substrate during the X-RAY drilling target operation. The auxiliary reinforcement material and the multi-layer substrate are pressed together by a pressing plate, and the temperature rise rate and thermal uniformity of the pressing plate are controlled during the pressing process.

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PUM

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Abstract

The invention discloses a layer-to-layer registration control method for inner layers of an HDI (High Density Interconnector) board. The method comprises the following steps: performing earlier-stage detection on a film used for making inner layer lines and patterns, wherein the earlier-stage detection of the film includes earlier-stage compensation of the film, and detection and picking of the used film in order to ensure that the rising and shrinking of the used film are within +/-1MIL, and the rising and shrinking of a diagonal line of the used film are within +/-1MIL; setting a monitoring point on the picked and used film which is proved to be qualified by detection; and repeatedly measuring rising and shrinking numerical values of the film by 200PNL/time and recording the rising and shrinking numerical values during making of the inner layer lines and the patterns with the film, and measuring rising and shrinking data of the film and recording the rising and shrinking data after the inner layer lines and the patterns are made. The technical scheme has the advantages that the defects of a current production flow can be overcome, and the design is reasonable and novel.

Description

technical field [0001] The invention relates to a method for controlling alignment between inner layers of an HDI board and a preparation method thereof, belonging to the field of circuit board production. Background technique [0002] With the technological innovation of electronic products, PCB boards with sparse circuits and large finished products can no longer meet the needs of the market. Many electronic products are developing in the direction of high precision, high integration and high performance. The survey results show that the proportion of high-precision and high-integration printed PCB boards in the electronics market has greatly increased. At present, most PCB board manufacturing companies are already developing towards high-precision and highly integrated printed circuit boards. As a PCB manufacturer, we must try our best to develop the process of upgrading dense circuits in order to gain a firm foothold in the future market. . The production of HDI boards...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46
CPCH05K3/4638H05K2203/166
Inventor 叶志诚黄勇文国堂
Owner 奥士康精密电路(惠州)有限公司
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