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Electrodeposited copper foil for printed wiring board and copper clad laminate using the same

A technology for printed wiring boards and copper clad laminates, applied in printed circuits, printed circuits, printed circuit manufacturing, etc., can solve the problems of reduced glossy mirror gloss, abnormal protrusions on rough surfaces, and insufficient copper cores, etc. Achieve excellent work efficiency, good machine mobility, and the effect of suppressing abnormal protrusions

Active Publication Date: 2020-07-28
FUKUKA METAL FOIL & POWDER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0023] However, the disadvantage is that in the electrolytic copper foil disclosed in Patent Document 1, in order to avoid a reduction in the specular gloss of the glossy surface, the deposition is carried out using a drum-shaped rotating cathode polished so as to avoid polishing streaks as much as possible. Therefore, there is a problem that the generation of copper nuclei during electrolysis is insufficient, and a large number of abnormal protrusions are generated on the rough surface side.

Method used

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  • Electrodeposited copper foil for printed wiring board and copper clad laminate using the same
  • Electrodeposited copper foil for printed wiring board and copper clad laminate using the same
  • Electrodeposited copper foil for printed wiring board and copper clad laminate using the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0053] Examples of the present invention are shown below, but the present invention is not limited thereto.

[0054]

[0055] A drum-shaped rotating cathode made of titanium is used, and a cylindrical polishing wheel of No. 1500 (manufactured by Kure Grinding Wheel Co., Ltd., the same below) using silicon carbide as abrasive grains is used for finish polishing, so that the surface roughness Rz of the cathode is JIS94 1.5 μm or less.

[0056] Thereafter, an electrolytic copper foil having a thickness of 12 μm was produced under the conditions in Table 1.

[0057] [Table 1]

[0058] Copper Sulfate Pentahydrate 280g / L sulfuric acid 80g / L chlorine 40ppm Electrolyte temperature 38℃ current density 40A / dm 2

Embodiment 2 and 3

[0060] The drum-shaped rotating cathode made of titanium is finely polished using a cylindrical polishing wheel No. 1200 with silicon carbide as the abrasive grain, so that the surface roughness of the cathode is Rz JIS94 1.5 μm or less.

[0061] Thereafter, an electrolytic copper foil having a thickness of 12 μm was produced under the conditions in Table 1.

[0062]

[0063] The drum-shaped rotating cathode made of titanium is finely polished using a No. 2000 cylindrical polishing wheel with silicon carbide as the abrasive grain, so that the surface roughness of the cathode is Rz JIS94 1.5 μm or less.

[0064] Thereafter, an electrolytic copper foil having a thickness of 12 μm was produced under the conditions in Table 1.

[0065]

[0066] The drum-shaped rotating cathode made of titanium was polished with a No. 1200 cylindrical polishing wheel using silicon carbide as abrasive grains, and then polished with a No. 2000 sheet-shaped polishing pad, and finely polished, so...

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Abstract

The purpose of the present invention is to provide an electrolytic copper foil having high elongation after heat treatment, high folding resistance, and few abnormal protrusions on the rough side. When the electrolytic copper foil is made into a copper-clad laminate, it can be applied to Flexible printed wiring board with low HAZE value. The present invention discloses an electrolytic copper foil for a printed wiring board, which uses the glossy surface of the electrolytic copper foil produced by continuous deposition on the surface of a drum-shaped rotating cathode as an insulating resin base material. The bonding surface, the specular gloss of the glossy surface at an incident angle of 60° in the TD direction is 220 or less, and the sum of the specular gloss of the glossy surface at an incident angle of 60° in the TD direction and the MD direction is 350 or more.

Description

technical field [0001] The present invention relates to an electrolytic copper foil used for a printed wiring board, and particularly relates to an electrolytic copper foil applicable to a flexible printed wiring board. Background technique [0002] In recent years, the miniaturization, weight reduction and high functionality of electronic equipment have been remarkable. In order to meet these requirements, flexible printed wiring boards that can be arranged in extremely small gaps in electronic equipment or that can be arranged three-dimensionally are widely used. In addition, flexible printed wiring boards Densification of electronic components on printed wiring boards is also progressing. [0003] As one of the methods of mounting electronic components on a flexible printed wiring board at high density, a method using an anisotropic conductive film is mentioned. In this method, an anisotropic conductive film is inserted between a printed circuit board and a flexible prin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/38C25D1/04
CPCH05K3/382C25D1/04H05K2201/0355Y02P10/20
Inventor 左近薰赤岭尚志
Owner FUKUKA METAL FOIL & POWDER CO LTD
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