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Selective copper electroplating process

An electroplating process and copper plating technology, which is applied in the field of selective copper plating electroplating process, can solve the problems of incomplete cleaning of product corners, time-consuming and labor-intensive wax application, uneven wax application, etc., to achieve good shielding and protection of electroplating areas, convenient cleaning, and improved manufacturing process stable effect

Active Publication Date: 2016-11-09
姑苏源电子(苏州)有限公司
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AI Technical Summary

Problems solved by technology

[0003] In the current process, due to the use of a wax-coated shielding layer, the phenomenon of incomplete cleaning of product corners and residual wax layer often occurs when cleaning and removing the wax-coated layer
In addition, waxing is time-consuming and labor-intensive, and uneven waxing will occur at the same time. If the number of cleanings is repeated for more than 3 times, the coating will change color

Method used

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  • Selective copper electroplating process

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Embodiment Construction

[0019] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention.

[0020] The present invention proposes a selective copper plating electroplating process, comprising the following steps: pre-treatment degreasing, water washing, activation, pre-plating copper cyanide, water washing, copper plating copper sulfate, cleaning, adding copper protective agent, drying, Also includes the following steps:

[0021] S1: Insert the rubber fixture 3 into the selected copper plating area: first fix the product 2 on the fixture 1 and then buckle the rubber into the selected electroplating area. The rubber fixture 3 does not need to be coated with wax, and the operation is simple, fast and convenient;

[0022] S2: Immerse the product 2 stuck in the rubber jig 3 in 100g / L chromic acid to remove the copper layer in the non-selective plating area for 1-3 minut...

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PUM

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Abstract

The invention provides a selective copper electroplating process. The selective copper electroplating process comprises the following steps: S1: embedding a rubber jig in a selective copper plating area: firstly, fixing a product on a clamp, then buckling rubber into the selective electroplating area, and enabling the periphery of rubber to be completely in close fit with the product without clearances or not-in-place assembly; S2: immersing the product clamped into the rubber jig in 100 g / L chromic acid for 1-3 min to remove a copper layer in the non-selective electroplating area; S3: cleaning with clear water for 1-2 min; S4: removing the rubber jig into which the product is clamped: placing the product in a jig clamping groove to separate the product from the rubber jig. According to the selective copper electroplating process, the rubber jig and a part are in close combination, so that the electroplating area can be well shielded and protected, other cleaning agents cannot be in direct contact with the plating layer, and accordingly, cleaning is more convenient; the process is more stable; influences on the plating layer, caused by cleaning and shielding a wax layer, are reduced; and the jig is adopted instead to perform direct shielding, so that the cleaning is convenient, and the operation is simpler.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to a selective copper plating electroplating process. Background technique [0002] The current selective partial copper plating process uses copper plating first and then waxes the selective area for protection and shielding, the unshielded part of the coating is removed, and then the wax layer is partially cleaned with a wax removal reagent to obtain the required selective copper plating. product. [0003] Due to the use of a wax-coated shielding layer in the current process, the phenomenon of incomplete cleaning of product corners and residual wax layer often occurs when cleaning and removing the wax-coated layer. In addition, waxing is time-consuming and labor-intensive, and uneven waxing will occur at the same time. If the number of repeated cleanings exceeds 3 times, the coating will change color. Contents of the invention [0004] In order to solve the above techni...

Claims

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Application Information

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IPC IPC(8): C23F1/02C23F1/44C25D5/10C25D3/38
CPCC23F1/02C23F1/44C25D3/38C25D5/10
Inventor 顾宇
Owner 姑苏源电子(苏州)有限公司
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