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LED lamp radiator

A technology for LED lamps and radiators, applied in lighting and heating equipment, semiconductor devices for light-emitting elements, cooling/heating devices for lighting devices, etc. Easy processing, large heat dissipation area and uniform heat dissipation

Inactive Publication Date: 2016-11-09
池州市安安精工铝业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Among the commonly used materials, copper is expensive, has a large specificity, and is not bad in processability. Inorganic non-metallic materials with good thermal conductivity are generally powdery before processing, and need to be processed and shaped by special processes. After being processed into radiators, they are basically in the form of ceramics. Some inorganic non-metallic materials have high thermal conductivity and are very insulating, but the price is high, and some have high thermal conductivity but are not insulating

Method used

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  • LED lamp radiator

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Embodiment Construction

[0013] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific illustrations.

[0014] A heat sink for LED lights, including an axis 1, heat dissipation pages 2, and gaps 3 between the pages. The base body of the heat sink is a cylindrical structure made of a low-alloyed Al-Mg-Si series high-plasticity alloy, which is strengthened by heat treatment. High impact toughness, insensitive to notch, excellent welding performance and corrosion resistance, no tendency of stress corrosion cracking, after extrusion molding, the center is the axis 1 of the cylinder, and 40- 50 cooling sheets 2, between every two cooling sheets 2 are gaps 3 of the same size as the number of cooling sheets 2, through which most of the heat produced by the lamp is dissipated, and the heat dissipation is fast.

[0015] The heat dissipation sheet 2 is thin...

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Abstract

The invention discloses an LED lamp radiator, and belongs to the technical field of lamp accessory design. The LED lamp radiator comprises an axis, radiating sheets and sheet gaps; a radiator body is a cylindrical structure made of low alloyed Al-Mg-Si-base high-plasticity alloy, heat treatment is carried out for reinforcing, impact toughness is high, the radiator body is insensitive to notches, good in welding performance and corrosion resistance, the trend of stress corrosion cracking is avoided, and the axis with the cylindrical center is formed through extrusion forming; 40-50 radiating sheets are evenly distributed on the periphery of the cylindrical axis, one sheet gap is formed between every two radiating sheets, the number of the sheet gaps is equal to that of the radiating sheets, and as most heat generated by a lamp is radiated through the radiating sheets and the sheet gaps, radiation is fast. The LED lamp radiator is large in radiating area, obvious in radiating effect, high in radiating performance, light in weight, convenient to machine and uniform in radiation.

Description

technical field [0001] The invention relates to the technical field of lamp accessories design, in particular to a heat sink for LED lamps. Background technique [0002] The LED heat sink is a component that can quickly export and dissipate the heat generated by the LED chip to the environment. Therefore, it is not enough to have a certain heat dissipation area as a heat sink. The material used to make the heat sink must have certain thermal conductivity. , That is to say, it must have a high thermal conductivity, so that the heat generated by the chip can be continuously exported, and finally dissipated into the environment. Easy to process and so on. Among the commonly used materials, copper is expensive, has a large specificity, and is not bad in processability. Inorganic non-metallic materials with good thermal conductivity are generally powdery before processing, and need to be processed by special processes. After being processed into radiators, they are basically cer...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21V29/77F21Y115/10
CPCF21V29/77
Inventor 刘沛峰刘明华项泽元盛锦荣
Owner 池州市安安精工铝业有限公司