Unlock instant, AI-driven research and patent intelligence for your innovation.

Manufacturing method of flexible mounting module body

A technology for installing modules and manufacturing methods, which is applied in semiconductor/solid-state device manufacturing, printed circuit manufacturing, and identification devices, etc., can solve problems such as substrate deformation, strain, and display image degradation, and achieve improved peel strength and reliable electrical connection.

Active Publication Date: 2018-11-30
DEXERIALS CORP
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, in order to further improve the flexibility of the flexible display substrate, if the plastic film used as the substrate is thinned or its rigidity is reduced, the deformation and strain of the substrate will occur during the above-mentioned heating and pressing. Based on this, the display Image has a tendency to degrade

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Manufacturing method of flexible mounting module body
  • Manufacturing method of flexible mounting module body
  • Manufacturing method of flexible mounting module body

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0072] Hereinafter, it demonstrates more concretely using an Example.

[0073] First, add 5 parts by mass of a resin solution in which 100 parts by mass of acrylonitrile rubber (NBR-1, the center value of the bound acrylonitrile amount is 18%) is dissolved in MEK (methyl ethyl ketone) as a solvent while stirring. Silica fine particles (25) with a primary particle diameter of 12 nm (AEROSIL Japan, AEROSILR-974) were further dispersed, and a dispersion liquid in which silica fine particles were dispersed in an acrylonitrile resin solution was obtained.

[0074] Next, the above-mentioned dispersion liquid is put into a coating device, and coated on a base material film (22) (polyethylene terephthalate film, 75 μm thick), and the above-mentioned MEK is volatilized in a drying oven to obtain a film with a thickness of Adhesive film ( 20 ) of Example 1 with an adhesive layer ( 21 ) of approximately 17 μm (approximately 92 μm thick with the base material film).

[0075] Next, adhesi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The electric connection between the electronic component (9) using the anisotropic conductive film (12) and the electrode (6) is reliable. First, an adhesive film (20) is pasted on the back side of the mounting area (10) of the flexible substrate (11), and electronic components (9) are mounted on the front side. The adhesive film (20) has an adhesive layer (21) formed on the base material film (22), and the adhesive (26) of the adhesive layer (21) contains silica fine particles with a primary particle diameter of less than 100 nm (25), the shear storage modulus at 160° C. is 0.15 MPa or more. When the anisotropic conductive film (12) is arranged on the mounting area (10) and the electronic component (9) is mounted on it by heating and pressing, the adhesive (26) in the adhesive layer (21) will not squeeze out The conductive particles (19) sandwiched between the bump (13) and the electrode (6) are pressed and crushed, so that the electrical connection becomes reliable.

Description

technical field [0001] The present invention relates to a technique for manufacturing a flexible substrate on which electronic components are mounted. Background technique [0002] From the viewpoint of convenience and portability, a display device in which an image display portion has flexibility (flexibility), such as a thin-film liquid crystal display or a flexible organic EL display, has attracted attention. [0003] A flexible display substrate is used as a main part of such a display device. The flexible display substrate has an image display area for displaying images on a flexible substrate such as a plastic film with high flexibility and high transparency, and electronic components (such as , driver IC) mounting area. Furthermore, when mounting electronic components, generally, a thermosetting anisotropic conductive film is placed in a mounting region, the electronic component is placed on the anisotropic conductive film, and then fixed by heating and pressing. I...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/32G09F9/00H01L21/60H05K1/02H05K1/18
CPCG09F9/00H01L2224/16225H01L2224/32225H01L2224/73204H01L2224/83192H05K1/189H05K3/323H05K2201/10128H01L24/81H01L2924/14H01L2224/81191H01L2224/83101H01L2224/2939H01L2224/29455H01L2224/29444H01L2224/83203H01L2924/00014H01L2224/81903H01L2224/83851H01L24/83H01L24/29H01L24/16H01L24/32H01L24/73H01L2224/83862H01L2924/00012H01L2224/13099H01L24/92H01L2224/2919H01L2224/81203H01L2924/12044H01L2924/20105H05K3/321H05K3/3494H05K2201/10136
Inventor 松岛隆行
Owner DEXERIALS CORP