3D printing and manufacturing method for electronic device with three-dimensional structure

Abstract

The invention discloses a 3D printing and manufacturing method for an electronic device with a three-dimensional structure. The 3D printing and manufacturing method comprises the following steps: according to performance requirements of a to-be-formed part, designing spatial distribution of circuits and geometric dimensions of base structures in the electronic device with the three-dimensional structure, establishing a model of three-dimensional CAD, carrying out hierarchical processing on the model according to a processing direction to obtain material distribution of a section at each layer, and writing relative movement programs of a printing head integrated unit and a working platform; then, selecting a conducting wire printing material and a base material printing material which meet the performance requirements; printing a base material, forming the base structures on the working platform; switching the printing head; printing conducting wires; and driving the working platform to descend by a hierarchical thickness by a movement mechanism, repeating a printing process of printing the base material and the conducting wires until all base structures and conducting wires are printed, thereby obtaining the electronic device with the three-dimensional structure. The 3D printing and manufacturing method realizes synchronous printing of conducting wires and a base insulating medium, so that any layout of a three-dimensional space is realized.

Description

technical field [0001] The invention relates to the technical field of structural electronics manufacturing, in particular to a 3D printing manufacturing method of a three-dimensional structural electronic device. Background technique [0002] Structural electronics refers to a three-dimensional electrical structure in which circuits and electronic components are attached or embedded on a substrate structure according to a certain three-dimensional space layout. Its core features are: the electrical part has a three-dimensional spatial layout, which improves the space utilization rate and reduces the volume; the matrix structure has a three-dimensional shape, so that the structural electronics as a whole have certain mechanical properties. Taking advantage of these beneficial properties, structural electronics can be used to manufacture a large number of new electronic devices to realize the integration of function and structure, such as curved surface conformal electronic d...

AI Technical Summary

Problems solved by technology

It can be seen that the existing process methods cannot meet the manufacturing requirements of structural electronic devices with functional-structural integration, and process innovation is needed to realize the manufacture of new three-dimensional structural electronic devices

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