PCB (Printed Circuit Board) chip structure

Abstract

This application relates to the field of chip technology, in particular to a PCB chip structure, including a PCB and a chip mounted on one side of the PCB, and a heat dissipation layer is provided on the surface of the area corresponding to the chip on the other side of the PCB ; The PCB is located in the corresponding area between the chip and the heat dissipation layer, and a thermal hole is provided; this structure can quickly dissipate the heat accumulated in the PCB in the chip area, and the manufacturing process is simple, reliable, and low in cost. It is also very low, which can effectively reduce the chip junction temperature in high-density PCB design and improve product reliability.

Description

technical field [0001] The present application relates to the field of chip technology, in particular to a PCB chip structure. Background technique [0002] PCB (Printed Circuit Board), the Chinese name is printed circuit board, also known as printed circuit board, printed circuit board, is an important electronic component, a support for electronic components such as chips, etc., and a provider of electrical connections for electronic components By. [0003] For reliability reasons, integrated circuits that handle high power levels increasingly need to meet thermal management requirements. All semiconductor electronic components have a specified safe upper limit for junction temperature, usually 150°C (sometimes 175°C). Like the maximum supply voltage, the maximum junction temperature is a worst-case limit and must not be exceeded. In a conservative design, a sufficient safety margin is generally left. And the lifetime of a semiconductor is inversely proportional to the...

AI Technical Summary

Problems solved by technology

[0005] The above-mentioned technical defect is that although the PCB exposed copper immersion gold process is helpful to the heat dissipation of the PCB in the area of ​​the chip (referring to a power device with a large heat generation), it is somewhat insignificant for a device with a large heat generation such as a chip. It can have a certain heat dissipation effect, but the space in mobile devices is small, there is not enough space for heat sinks, and other processes are used to trace wires on the surface of high-density line areas, the heat dissipation is not ideal, and additional layers are needed, so the cost will be greatly increased promote

The heat dissipation solution of adding graphite between the chip and the PCB is suitable for packages without pins at the bottom of the chip, but chips used in mobile phones generally have pins at the bottom, and some BGA chips even have hundreds of pins, which is obviously impossible. A layer of graphite is inserted between the chip and the PCB

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