Remote chip detection system of graphene probe sensing unit

Abstract

In order to realize high-accuracy semiconductor detection which does not need to be provided with an auxiliary structure like a pseudo gate electrode at lower cost, consider the automatic processing of a contact probe pressure signal level during a signal processing period and simultaneously carry out the transmission and the monitoring of a remote detection state, the invention provides a remote chip detection system of a graphene probe sensing unit. The remote chip detection system comprises a semiconductor driving unit, a horizontal driving unit of a contact probe, a vertical driving unit of the contact probe, an electric detection unit, a pressure detection unit and a remote communication unit, wherein the semiconductor driving unit, the horizontal driving unit of the contact probe and the vertical driving unit of the contact probe are mutually connected in series by a driving signal line and are driven in sequence; the pressure detection unit takes a driving finishing signal of the vertical driving unit of the contact probe as an initial signal of driving; a signal output by the pressure detection unit is input into the electric detection unit.

Description

technical field [0001] The invention relates to the technical field of semiconductor detection, and more specifically, to a remote chip detection system of a graphene probe sensing unit. Background technique [0002] With the rapid development of semiconductor manufacturing technology, in order to achieve faster computing speed, larger data storage capacity and more functions of semiconductor devices, semiconductor wafers are developing towards higher component density and high integration, and gates become Thinner and shorter in length than ever before. Therefore, the patterning accuracy for forming the gate is higher. In order to ensure the flatness of the surface, when forming the gate electrodes, it is preferable to form dummy gate electrodes so that the distribution of the gate electrodes is uniform. It is better to distribute dummy local interconnects when arranging via holes and local interconnect grooves, and such dummy structure regions are usually designed by aut...

AI Technical Summary

Problems solved by technology

However, this scheme is not applicable in some occasions that require high precision

Images