Low temperature superconducting magnet joint lap joint soldering technology

A low-temperature superconducting and soldering technology, applied in superconducting magnets/coils, magnetic objects, connecting contact materials, etc., can solve the problems of increasing joint resistance, affecting the contact effect, reducing strength, etc., to achieve low contact resistance, The effect of high reliability and strong operability

Inactive Publication Date: 2017-01-04
合肥聚能电物理高技术开发有限公司
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  • Abstract
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  • Application Information

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Problems solved by technology

This lapping method often leaves flux and tin oxides between the contact surfaces of the two joints, which affects the contact effect, resulting in increased joint resistance and reduced strength. Therefore, a reliable lap soldering technology is designed to ensure It is an urgent problem to be solved that the joint can meet the requirements of high contact strength, low contact resistance and high reliability.

Method used

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  • Low temperature superconducting magnet joint lap joint soldering technology
  • Low temperature superconducting magnet joint lap joint soldering technology
  • Low temperature superconducting magnet joint lap joint soldering technology

Examples

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Embodiment Construction

[0023] A low-temperature superconducting magnet joint lap soldering technology, which is characterized in that it includes two steps of tin-coating on the copper surface of the superconducting conductor 1 and double joint lap soldering. The superconducting joint of the superconducting conductor 1 is connected with Liquid helium tube 5, of which:

[0024] The specific steps of tin hanging on the copper surface of the single joint are as follows:

[0025] (1) The copper surface 4 of the single joint box body Ⅰ2 and joint box body Ⅱ7 is placed horizontally upwards, the stainless steel surface 3 of the joint is covered with a cast aluminum heating plate, and the temperature monitoring points are arranged on both sides of the joint copper surface 4;

[0026] (2) The joint is heated at a heating rate of 5°C / min. When the temperature of the copper surface 4 of the joint reaches 120°C, the heating equipment is adjusted to the heat preservation state. At this time, the joint copper surface 4 ...

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Abstract

The invention discloses a low temperature superconducting magnet joint lap joint soldering technology which comprises the steps of single joint copper surface tin-plating and double joint lap joint soldering. Compared with a traditional joint lap method, the technology provided by the invention has the advantages that through single joint copper surface tin-plating, a tin material can completely infiltrate and cover the copper surface of a joint, and oxide and impurities in the tin material can be easily removed; when double joint lap joint soldering is carried out, new solder and flux are not added, and flux and oxide residues on the joint contact surface are prevented; double joint lap joint uses automatic pressurization and heating equipment, which realizes precise control of heating and pressing rate of a lap joint process; and the technology has the advantages of high field operability, high joint reliability, low contact resistance and high contact strength.

Description

Technical field [0001] The invention discloses a new type of lap soldering technology for a low-temperature superconducting magnet joint, which is used for the connection between a low-temperature superconducting magnet of an armored cable conductor (CICC) structure and a low-temperature transmission line. [0002] technical background [0003] At present, low-temperature superconducting magnets with CICC structure are widely used in strong magnetic field and fusion experimental devices. The superconducting joint is used for the transmission of current and liquid helium between the superconducting magnet and the low-temperature feeder, and has the requirements of high contact strength, high current resistance, low contact resistance, and high reliability. Superconducting joints are usually made of high-conductivity oxygen-free copper-316L stainless steel composite plates, where the high-conductivity oxygen-free copper layer is used for current transmission, and the 316L stainless s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R43/02H01R4/68H01F6/00
CPCH01F6/00H01R4/68H01R43/0207H01R43/0235
Inventor 刘志宏吴杰峰陈安飞张怀斌谭勇
Owner 合肥聚能电物理高技术开发有限公司
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