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Electronic system self-radiating structure

An electronic system and self-heating technology, which is applied to the structural parts of electrical equipment, electrical components, cooling/ventilation/heating renovation, etc., can solve the problems of the electronic system cooling plate 44 being unable to fit closely, affecting the thermal coupling efficiency, etc.

Active Publication Date: 2017-01-04
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

The thermal deformation or uneven welding surface generated during the welding process of the heat sink 22 and the cooling plate 44 will cause the electronic system 11 and the cooling plate 44 to be unable to fit tightly during the assembly process, thereby generating a part of the air interlayer between the two plates. During the heat exchange process, the heat conduction efficiency of the air layer is much lower than that of metal materials, which affects the thermal coupling efficiency

Method used

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  • Electronic system self-radiating structure
  • Electronic system self-radiating structure
  • Electronic system self-radiating structure

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Embodiment Construction

[0018] Below in conjunction with accompanying drawing and embodiment the present invention is described in detail:

[0019] Such as figure 2 As shown, the present invention discloses a self-dissipating structure of an electronic system. A heat dissipation medium groove is processed on the electronic system substrate and filled with a circulating heat dissipation medium. The heat dissipation medium flows inside the electronic system and directly contacts the electronic system, providing Good cooling efficiency.

[0020] Among them, the electronic system 2 adopts a metal substrate. On the one hand, the thermal conductivity of the metal substrate is larger than that of the polymer substrate, and the thermal conductivity is better. seal. The thickness of the metal substrate depends on the strength of the substrate and the pressure of the cooling medium. It is recommended that the thickness of the metal substrate be greater than 4mm. Wiring on the upper surface of the metal sub...

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Abstract

The invention discloses an electronic system self-radiating structure including an electronic system and a sealing bottom plate, the electronic system includes a metal substrate and an electronic component, the electronic component is wired and welded on the upper surface of the metal substrate, a bending cooling tank is processed in the lower surface of the metal substrate, a single-layer or double-layer sealing groove is processed in the outer side of the cooling tank, and a flange connecting hole matched with the sealing bottom plate is processed in the outer side of the single-layer or double-layer sealing groove. The system integral structure is simplified, the size is reduced, the weight is reduced, and the heat exchange efficiency is improved, and the self-radiating function of the electronic system is achieved.

Description

technical field [0001] The invention relates to a high-efficiency heat dissipation structure, which is especially suitable for self-radiation of electronic systems. Background technique [0002] In the modern industrial environment, with the increasing sophistication of production technology, the rapid development of information computing speed, and the increasing surge of storage technology, a large number of high-power systems have emerged to realize functions such as control, calculation, and transmission, such as electronic systems embedded with high-power chips or devices . In order to ensure the normal operation of high-power electronic systems, various air-cooled and medium-cooled heat sinks have emerged one after another. Air-cooled fins or heat sinks sealed with heat dissipation media are connected to the electronic system by welding, crimping, and bolting. Tightly coupled, through the heat exchange with the heat sink, the excess heat of the high-power system is ta...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/20254H05K7/20272H05K7/20927
Inventor 吴晓斌张罗莎王魁波陈进新罗艳谢婉露周翊王宇崔惠绒
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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