Self-focusing laser processing device

A laser processing and self-focusing technology, which is applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve difficult problems and difficult to meet the requirements of final focusing, so as to improve energy density, ensure etching accuracy and efficiency, The effect of narrowing the aperture

Active Publication Date: 2017-01-11
GUILIN UNIV OF ELECTRONIC TECH
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AI Technical Summary

Problems solved by technology

[0007] However, it is difficult to achieve the laser beam focusing required for laser processing only by relying on the self-focusing effect, and it is also difficult to achieve the final focusing requirements.
Therefore, laser processing equipment using self-focusing media has not yet appeared in the market

Method used

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  • Self-focusing laser processing device

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Embodiment Construction

[0023] Examples of the self-focusing laser processing device figure 1 As shown, it includes a laser, a lens 1, a container 2 for holding a nonlinear medium, a water jet auxiliary device 4 and a workbench. The workpiece is fixed on the surface of the worktable, and the laser beam of the laser is reflected by the mirror to change its direction, and then focused on the surface of the workpiece through the lens 1. The clamping mechanism 3 fixes the container 2 between the lens 1 and the workbench, and the centerlines of the laser beam, the lens 1 and the container 2 are on the same vertical line. This example container 2 holds liquid carbon disulfide.

[0024] The wavelength of the laser in this example is 1024nm, the pulse energy intensity is 400mJ, the repetition rate is 10HZ, the pulse width is 15ns, the diameter of the parallel laser beam is D=4mm, the lens 1 focuses on the surface of the liquid, and the diameter of the laser beam at the focal point is d= 1.45mm; the linear ...

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Abstract

The invention relates to a self-focusing laser processing device. A container for containing a non-linear medium is fixed between a lens and a workbench by the aid of a clamping mechanism. A laser beam is focused on the surface of the non-linear medium, the laser beam focused by the lens enters the non-linear medium to be transferred to produce self-focusing, and through two times of focusing by the lens and the non-linear medium, the laser beam leaving the container has the extremely small diameter and is linearly spread to the surface of a workpiece. The depth of the non-linear medium in the container, that is, the self-focusing distance L is related to energy of the laser beam and the refractive index of the adopted non-linear medium. A water jet auxiliary device is also provided, and the laser focus point on the surface of the workpiece coincides with the jet injection point center. Impact of water jet on the surface of the workpiece carries away residues and heat removed by laser. Lens focusing and self-focusing are combined, almost half of the diameter of the laser beam is reduced, and the energy density of the laser beam is increased. Laser alignment transfer is realized after self-focusing, the divergence angle is small, longitudinal etching is facilitated, the processing depth is increased, and the etching accuracy and efficiency are guaranteed.

Description

technical field [0001] The invention relates to the technical field of laser processing, in particular to a self-focusing laser processing device. Background technique [0002] Laser processing is an important technology in the field of micromachining. It has the advantages of high-speed and precise cutting of materials and no tool wear. It has been used in different fields as a very effective fine processing method. [0003] During laser processing, the size of the spot at the laser focus is an important parameter that affects the processing quality. In traditional laser processing, laser light is converged by a focusing lens to form a focal point, and the workpiece is processed near the focal point. The smaller the laser focus spot, the more precise the processed parts can be obtained. [0004] Generally, when laser processing starts, the laser is focused on the surface of the workpiece. However, as the laser etches from the surface of the workpiece to the depth, the ab...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/046B23K26/06B23K26/362B23K26/146
CPCB23K26/046B23K26/06B23K26/146B23K26/361
Inventor 龙芋宏鲍家定唐文斌周嘉刘清原刘鑫毛建冬
Owner GUILIN UNIV OF ELECTRONIC TECH
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