Method for cutting ultra-thin tempered glass by laser

Abstract

The invention provides a method for cutting an ultra-thin tempered glass by laser. Compared with the existed mechanical CNC (computer numerical control) grinding on the market, energy of a laser beam cuts a glass by a non-contact way, and the method avoids the shortcoming of edge breakage caused by mechanical contact; meanwhile, for the heating action zone of the laser is small, the end face cutting quality is higher; as for the ultra-thin tempered glass, laser can reach good cutting but CNC grinding cannot achieve; compared with laser ablation technology of picosecond galvanometer, taper of the glass end face is eliminated for the light beam scans the glass sample surface vertically after focusing, and thus the radial loading capacity of a sample is promoted; cutting process is one-time molding, the roughness of the sample end face is largely reduced and the sample quality is further promoted; moreover, the processing speed is better than the galvanometer scanning way; the method is applicable to the large-batch production and further promotes the product yield, and is good for industrial application.

Description

technical field [0001] The invention relates to laser processing technology, in particular to a method for laser cutting ultra-thin strengthened glass. Background technique [0002] With the continuous improvement of smartphone functions, fingerprint recognition function has gradually become the standard configuration of mainstream smartphones, and the demand for fingerprint recognition glass is also increasing day by day. While mobile phones are developing towards lightweight, miniaturization, and low cost, the fingerprint recognition glass is also changing from the original 0.3mm thick sapphire to 0.2mm or even thinner ordinary tempered glass, which makes it impossible for fingerprint recognition glass to adopt traditional obtained by CNC machining. [0003] At present, the main processing method of fingerprint identification glass is picosecond laser ablation. The picosecond laser ablation method uses a laser with a pulse width of picosecond level and a vibrating mirror...

AI Technical Summary

Problems solved by technology

This cutting method is a one-time molding, and the end surface is neat and rough; but this method is suitable for glass with a thickness greater than 0.4mm. When the thickness of the glass is less than 0.3mm, when the external force is applied to separate the glass after cutting, it is found that the glass will have serious chipping and hanging. Slag defects, resulting in low yield after cutting

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