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Dressing control system and method for grinding wheel

A technology of control system and grinding wheel, which is applied in the direction of automatic grinding control devices, manufacturing tools, grinding machine parts, etc., can solve the problems of less substrate removal, low processing efficiency, rough substrate surface processing, etc., and achieve improved The effect of processing efficiency and surface processing accuracy, ensuring grinding ability, and increasing removal amount

Active Publication Date: 2017-02-15
CETC BEIJING ELECTRONICS EQUIP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a dressing control system and method for grinding wheels, which are used to solve some superhard substrate materials in the prior art, the substrate removal amount is small, the processing efficiency is low and the surface processing of the substrate is difficult during the grinding process. rough question

Method used

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  • Dressing control system and method for grinding wheel
  • Dressing control system and method for grinding wheel
  • Dressing control system and method for grinding wheel

Examples

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no. 1 example

[0051] Such as figure 1 As shown, the embodiment of the present invention provides a dressing control system for a grinding wheel, including:

[0052] Carrier mechanism, spindle grinding mechanism, oilstone dressing mechanism;

[0053] What needs to be explained here is that the chip holder mechanism includes: the chip holder 1; the main shaft grinding mechanism includes: the main shaft (not shown in the figure) and the main shaft grinding wheel 2 connected with the main shaft; the oil stone dressing mechanism includes: the oil stone 3 and the brush ( not shown in the figure).

[0054] A spindle rotation drive mechanism 4 for driving the rotation of the spindle grinding mechanism;

[0055] A spindle feed drive mechanism 5 for driving the spindle grinding mechanism to move axially along the spindle of the spindle grinding mechanism;

[0056] A wafer table rotation drive mechanism (not shown in the figure) for driving the wafer table mechanism to rotate;

[0057] The whetsto...

no. 2 example

[0107] Such as Figure 4 As shown, the embodiment of the present invention also provides a grinding wheel dressing control method, which is applied to the grinding wheel dressing control system in the first embodiment, including:

[0108] Step 101, according to the pre-recorded first distance value of the whetstone in the whetstone trimming mechanism from the preset whetstone zero point position to the wafer stage in the wafer stage mechanism, control the whetstone rotation drive mechanism to drive the The whetstone rotates at a first preset speed, and controls the whetstone feeding drive mechanism to drive the whetstone to move upwards at a first preset speed in a direction parallel to the axial direction of the main shaft relative to the preset whetstone zero position When the second predetermined position is reached, the upward movement is stopped, and the second predetermined position is the first distance value + the initial thickness of the substrate material to be groun...

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Abstract

The invention provides a dressing control system and a dressing control method for a grinding wheel. The system comprises a wafer bearing platform mechanism, a main shaft grinding mechanism, an oilstone dressing mechanism, a main shaft rotating driving mechanism, a main shaft feeding driving mechanism, a wafer bearing platform rotating driving mechanism, an oilstone rotating driving mechanism, an oilstone feeding driving mechanism and a control module; the control module is connected with each of the oilstone rotating driving mechanism, the oilstone feeding driving mechanism, the main shaft rotating driving mechanism, the main shaft feeding driving mechanism and the wafer bearing platform rotating driving mechanism, wherein when the main shaft grinding mechanism moves to a first preset position relative to the wafer bearing platform mechanism, and the oilstone dressing mechanism moves to a second preset position relative to the main shaft grinding mechanism, the surface of a main shaft grinding is in contact with each of the surface of oilstone and the surface of the wafer bearing platform. According to the dressing control system and the dressing control method for the grinding wheel, the purposes of grinding a substrate material and dressing the sand wheel simultaneously can be achieved; the removal amount of the substrate material is increased; the machining efficiency and the surface machining precision of the substrate material are improved; meanwhile, the grinding capacity of the sand wheel is ensured.

Description

technical field [0001] The invention relates to the technical field of precision instrument processing, in particular to a grinding wheel dressing control system and method. Background technique [0002] In the grinding process of special equipment for semiconductors, substrate materials, such as wafer surface roughness and TTV (Total Thickness Variation, overall thickness deviation) directly depend on the shape of the grinding wheel and the cleanliness of the contact surface, otherwise it will cause grinding accuracy. error. [0003] At present, it is difficult to grind some ultra-hard substrate materials, such as sapphire and ceramics. During the grinding process, substrate residues will adhere to the grinding wheel, which will affect the substrate removal amount, processing efficiency and substrate surface processing accuracy. , while affecting the grinding ability of the grinding wheel. Contents of the invention [0004] The purpose of the present invention is to pro...

Claims

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Application Information

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IPC IPC(8): B24B51/00B24B53/06
Inventor 刘国敬杨生荣张文斌张景瑞高岳姚立新孙莉莉
Owner CETC BEIJING ELECTRONICS EQUIP
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