Surface-mounted microstrip ferrite circulator

A circulator and ferrite technology, applied in the field of surface mount microstrip ferrite circulators, can solve the problems of increased system integration cost, low manual welding efficiency, unfavorable cost control, etc., so as to improve assembly efficiency and simplify production process , the effect of reducing production costs

Inactive Publication Date: 2017-02-15
HUAYANG TECH DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the low efficiency of manual welding, it is not conducive to cost control; gold wire bonding requires additional equipment and processes, which will increase the cost of

Method used

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  • Surface-mounted microstrip ferrite circulator
  • Surface-mounted microstrip ferrite circulator
  • Surface-mounted microstrip ferrite circulator

Examples

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Embodiment 1

[0040] Please refer to Figure 1 to Figure 4 , Embodiment 1 of the present invention is as follows: figure 1 As shown, a surface-mounted microstrip ferrite circulator includes a spun ferrite substrate 1, a microstrip circuit 2 arranged on the upper surface of the spun ferrite substrate 1, and a microstrip circuit 2 arranged on the microstrip circuit 2. permanent magnet 3, the rotatable ferrite substrate 1 is provided with a notch 4 that runs through the upper and lower surfaces (in other embodiments, it can be set as a through hole), please combine figure 2 and image 3 , the pins 21 of the microstrip circuit 2 extend to the lower surface of the spun ferrite substrate 1 through the gap 4 and form a patch area 5 on the lower surface of the spun ferrite substrate 1, the spun ferrite substrate 1 The bottom surface of the ferrite substrate 1 is also provided with a grounding area 6 , and an isolation zone 7 is provided between the grounding area 6 and the patch area 5 . Specif...

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PUM

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Abstract

The invention discloses a surface-mounted microstrip ferrite circulator, which comprises a gyromagnetic ferrite substrate, a microstrip circuit arranged at the upper surface of the gyromagnetic ferrite substrate and a permanent magnet arranged on the microstrip circuit, and is characterized in that the gyromagnetic ferrite substrate is provided with through holes or openings penetrating through the upper and lower surfaces, pins of the microstrip circuit extend to the lower surface of the gyromagnetic ferrite substrate through the through holes or the openings and form a chip mounting area at the lower surface of the gyromagnetic ferrite substrate, the lower surface of the gyromagnetic ferrite substrate is further provided with a grounding area, and an isolation strip is arranged between the grounding area and the chip mounting area. According to the invention, the through holes or the openings are set so as to enable the microstrip circuit to extend from the upper surface of the gyromagnetic ferrite surface to the lower surface of the gyromagnetic ferrite surface, and the pins of the microstrip circuit are enabled to be located at the same horizontal plane with the grounding area, so that the microstrip ferrite circulator is enabled to be assembled with a PCB (Printed Circuit board) by using an SMT (Surface Mount Technology).

Description

technical field [0001] The invention relates to a microstrip ferrite circulator, in particular to a surface-mounted microstrip ferrite circulator. Background technique [0002] With the rapid development of microwave integrated circuits and microstrip antenna T / R components, communication products have higher requirements for microstrip circulators. How to make microstrip circulators smaller, lighter and more integrated , lower production cost, easier manufacturing process and many other issues have become the research hotspots of microstrip circulators. [0003] Traditional microstrip ferrite circulators are embedded (Drop-in) structures, microstrip ferrite circulators are embedded on the PCB board, and "T"-shaped pins protrude from the upper surface of the rotating ferrite substrate , and then electrically connect the pins to the circuit on the PCB board by manual soldering or gold wire bonding. Due to the low efficiency of manual welding, it is not conducive to cost con...

Claims

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Application Information

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IPC IPC(8): H01P1/387H01P1/38
CPCH01P1/387H01P1/38
Inventor 黄帝坤熊飞李茂红张再祥郭欢欢
Owner HUAYANG TECH DEV
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