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Silicon resin film, solidifiable silicon resin composition, optical semiconductor device and packaging method thereof

A technology of silicone resin and composition, applied in semiconductor devices, coatings, electrical components, etc., can solve problems such as uneven distribution of phosphor powder, poor light extraction efficiency, and impure light color, so as to improve production yield, Excellent thermal softening properties, not easily deformed or brittle

Inactive Publication Date: 2017-02-22
BENQ MATERIALS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Traditionally used in the dispensing packaging process or molding packaging process for Light Emitting Diode (LED), in the packaging process, it is necessary to mix the liquid packaging glue with the phosphor powder before dispensing or Pour into the mold and other steps, and finally complete the packaging of the LED chip through curing. Therefore, under the multi-step process, the phosphor powder is easy to be unevenly distributed or precipitated, resulting in disadvantages such as poor light extraction efficiency or impure light color.
Furthermore, during the encapsulation process of dispensing or molding, the excitation light emitted by the chip passes through each phosphor particle in a different path, thus causing color shift and other phenomena.

Method used

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  • Silicon resin film, solidifiable silicon resin composition, optical semiconductor device and packaging method thereof
  • Silicon resin film, solidifiable silicon resin composition, optical semiconductor device and packaging method thereof
  • Silicon resin film, solidifiable silicon resin composition, optical semiconductor device and packaging method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation Embodiment 1

[0096] The preparation method of linear polysiloxane (compound 1)

[0097] 3499.92 grams (19.13 mole) of methylphenyl dimethoxysilane (phenylmethyldimethoxysilane, purchased from Hengqiao Industrial Co., Ltd., Taiwan), 288.48 grams (2.4 mole) of dimethyldimethoxysilane (Dimethyldimethoxysilane, Purchased from Hengqiao Industrial Co., Ltd., Taiwan), and 317.28 grams (2.4mole) of methylvinyldimethoxysilane (Methylvinyldimethoxysilane, purchased from Liuhe Chemical Co., Ltd., Taiwan) was added to the reaction tank and placed in Stir at room temperature to form a homogeneous mixed solution. This mixed solution is dropped into the sulfuric acid aqueous solution (5337.4 grams) of mass concentration 5% to obtain reaction solution, then this reaction solution is heated to 75 ℃ to carry out hydrolysis, after the reaction is complete, extract with deionized water to make the organic layer reach pH The value is neutral, and finally the solvent is removed to obtain the hydrolyzate.

[0...

preparation Embodiment 2

[0100] The preparation method of the first silicone resin (compound 2)

[0101] With 2685 grams (13.5mole) of phenyltrimethoxysilane (phenyl-trimethoxysilane, purchased from Liuhe Co., Ltd., Taiwan), 349 grams (2.9mole) of dimethyldimethoxysilane (Dimethyldimethoxysilane, purchased from Hengqiao Industrial Co., Ltd., Taiwan), and 384 grams (2.9mole) of methylvinyldimethoxysilane (Methylvinyldimethoxysilane, purchased from Liuhe Chemical Co., Ltd., Taiwan) is placed in the reaction tank, at room temperature Stir to make a homogeneously mixed solution. The mixed solution is dripped in the sulfuric acid aqueous solution (4579 grams) of mass concentration 5% to obtain reaction solution, then this reaction solution is heated to 75 ℃ and hydrolyzes, and after the reaction is complete, extract with deionized water to make the organic layer reach The pH is neutral and the solvent is finally removed to obtain the hydrolyzate.

[0102]The above-mentioned hydrolyzate, 21.39 grams (0.11...

preparation Embodiment 3

[0104] The preparation method of the first silicone resin (compound 3)

[0105] 2776 grams (14 mole) of phenyl-trimethoxysilane (phenyl-trimethoxysilane, purchased from Liuhe Co., Ltd., Taiwan), 480.88 grams (4 mole) of dimethyldimethoxysilane (Dimethyldimethoxysilane, purchased from Hengqiao Industrial Co., Ltd., Taiwan), and 264.46 grams (2mole) of methylvinyldimethoxysilane (Methylvinyldimethoxysilane, purchased from Liuhe Chemical Co., Ltd., Taiwan) was placed in the reaction tank, stirred at room temperature to prepare Mix the solution evenly. Drop the mixed solution into an aqueous solution of sulfuric acid with a mass concentration of 5% to obtain a reaction solution, then heat the reaction solution to 75°C for hydrolysis, and after the reaction is complete, extract with deionized water to make the organic layer reach a neutral pH value. properties, and finally the solvent is removed to obtain the hydrolyzate.

[0106] The above-mentioned hydrolyzate, 21.39 grams (0.1...

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Abstract

The invention provides a silicon resin film, a solidifiable silicon resin composition, an optical semiconductor device and a packaging method thereof. The silicon resin film comprises a release base material and a silicon resin coating and is formed by solidifying the release base material with the solidifiable silicon resin composition, wherein the solidifiable silicon resin composition is prepared from, by weight, 10-25 parts of linear polysiloxane, 40-55 parts of first silicon resin, 15-30 parts of second silicon resin, 15-25 parts of polysiloxane containing silicon-hydrogen bonds, a platinum group metal catalyst and fluorescent powder, wherein an averaging unit structural formula for representing the first silicon resin at least has a R1SiO3 / 2 monomer and a R22SiO2 / 2 monomer, and the molar rate of the R1SiO3 / 2 monomer in the averaging unit structural formula is 0.60-0.75. The silicon resin film has the excellent thermal softening characteristic and the good hardness characteristic.

Description

technical field [0001] The invention relates to a silicone resin film, which can be used for encapsulating optical semiconductor devices, especially for encapsulating light emitting diodes (LEDs). Background technique [0002] Traditionally used in the dispensing packaging process or molding packaging process for Light Emitting Diode (LED), in the packaging process, it is necessary to mix the liquid packaging glue with the phosphor powder before dispensing or Pour into the mold and other steps, and finally complete the packaging of the LED chip through curing. Therefore, under the multi-step process, the phosphor powder is easy to be unevenly distributed or precipitated, resulting in disadvantages such as poor light extraction efficiency or impure light color. Furthermore, during the encapsulation process of dispensing glue or molding, the excitation light emitted by the chip travels differently through each phosphor particle, thus causing color shift and the like. [0003]...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D183/07C09D183/05C09D7/12H01L33/56
CPCC09D183/04C08L2205/025C08L2205/03C09D7/61C09D7/63H01L33/56C08L83/04C08K13/02C08K5/5455C08K3/36C08K5/05
Inventor 邓士杰黄如慧
Owner BENQ MATERIALS
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