Plate loop thermosiphon equal temperature plate

Abstract

The invention discloses a board type loop thermosyphon uniform-temperature board, and belongs to the heat dissipation technical field of an electronic device. The board type loop thermosyphon uniform-temperature board comprises annular grooves formed in a flat board body, wherein the annular grooves comprise left and right main channels and upper and lower bending channels connected with the left and main channels; and connecting channels arranged in a tilted manner are connected between the left and right main channels. By adoption of the board type loop thermosyphon uniform-temperature board, the dimension of a heat pipe can be reduced to be matched with an electronic device; the miniaturization is realized while the contact thermal resistance is lowered, and the two-phase flowing in the heat pipe is reinforced, so that the heat exchange efficiency of the electronic device is improved consequently.

Description

technical field [0001] The invention relates to a technology in the field of heat dissipation of electronic devices, in particular to a plate-type loop thermosyphon equalization plate. Background technique [0002] With the development of electronic technology, the number, power, and density of electronic components in various electrical appliances such as notebooks, smart phones, high-power LED modules, micro projectors, and laser generators have increased rapidly, resulting in increasing thermal power consumption. At the same time, the increase of heat flux increases the surface temperature of electronic components, thus affecting the stability and service life of electrical appliances. In order to achieve effective heat dissipation of electronic equipment, many improvement measures have been proposed in the industry for the type, structure and material of heat dissipation devices, but the effect is not very satisfactory. [0003] The traditional thermosiphon is a tubular...

AI Technical Summary

Problems solved by technology

However, traditional thermosiphons are not suitable for heat dissipation of electronic devices due to structural limitations.

[0004] In traditional thermosiphons, the gaseous working medium and the liquid working medium move in opposite directions. On the one hand, the carrying limit of the working medium is limited; Its limit power affects the heat transfer efficiency

[0005] Due to the miniaturization of electronic components, reducing the size of the heat pipe has become an inevitable development trend, and the reduction of the diameter of the heat pipe will inevitably lead to an increase in the flow resistance of the working medium in the tube, and the traditional thermosiphon is mostly a circular tube structure. However, most electronic devices are flat, and the circular tube structure is not conducive to the close combination of heat pipes and electronic heat dissipation parts, which will lead to an increase in contact thermal resistance and affect heat transfer efficiency.

Images