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Non-interlayer discontinuous pressure adding vacuum diffusion bonding technology for copper and aluminum alloy

A technology of vacuum diffusion and diffusion connection, which is applied in metal processing equipment, manufacturing tools, welding equipment, etc., can solve the problems of difficult to ensure the welding structure size, cumbersome connection process, and complicated process operation, so as to improve welding efficiency and broad application prospects , the effect of improving tissue performance

Inactive Publication Date: 2017-03-08
SHANDONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Chinese invention patent (2011 1 0256606.8) proposes a process of press-bonding diffusion welding of aluminum and dissimilar metals under non-vacuum conditions, but before welding, more than 30% of the parts to be welded must be upset and deformed, which is difficult to guarantee The size of the welded structure requires special fixtures and tooling, and the connection process is cumbersome
[0007] Chinese invention patent (2015 1 0780168.3) needs to use plasma-enhanced chemical vapor deposition vacuum device to hydrogenate the surface of aluminum and copper before performing vacuum diffusion welding of aluminum and copper, which has a significant effect on eliminating oxide film, but this The operation of this process is relatively complicated, requiring expensive plasma-enhanced chemical vapor deposition vacuum devices and equipment

Method used

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  • Non-interlayer discontinuous pressure adding vacuum diffusion bonding technology for copper and aluminum alloy
  • Non-interlayer discontinuous pressure adding vacuum diffusion bonding technology for copper and aluminum alloy

Examples

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Comparison scheme
Effect test

Embodiment 1

[0033] T2 red copper with a thickness of 4mm and 1060 industrial pure aluminum with a thickness of 2mm are connected by discontinuous pressure vacuum diffusion welding without an intermediate layer, and the workpiece size is 40mm×80mm.

[0034] The specific process steps are as follows:

[0035] (1) Surface cleaning before welding

[0036] Use different types of metallographic sandpaper to polish the surface of the workpiece to be connected to ensure the smoothness of the test plate. Use acetone to clean the surface of the workpiece to remove oil stains. Use 15% (mass fraction) NaOH solution to carry out alkali washing on the 1060 industrial pure aluminum test plate in a water bath heating at 60 ° C, keep it for 5 minutes, and then use 20% (mass fraction) HNO 3 The 1060 industrial pure aluminum is pickled, rinsed with alcohol, and dried for later use. Use 3% (mass fraction) HCl to pickle the T2 red copper, keep it for 3 minutes, then wash it with alcohol, dry it and set it ...

Embodiment 2

[0041] T2 red copper with a thickness of 2mm and 5A06 anti-rust aluminum with a thickness of 4mm are connected by discontinuous pressure vacuum diffusion welding without an intermediate layer, and the workpiece size is 60mm×60mm.

[0042] The specific process steps are as follows:

[0043] (1) Surface cleaning before welding

[0044] Use different types of metallographic sandpaper to polish the surface of the workpiece to be connected to ensure the smoothness of the test plate. Use acetone to clean the surface of the workpiece to remove oil stains. Use 20% NaOH solution to carry out alkaline cleaning on the 5A06 aluminum alloy test plate in a water bath heating at 40 ° C, keep it for 3 minutes, and then use 30% HNO 3 Pickle the 5A06 anti-rust aluminum, rinse it with alcohol, and dry it for later use. Use 10% HCl to pickle the T2 red copper, keep it for 5 minutes, then wash it with alcohol, and dry it for later use.

[0045] (2) Vacuum diffusion connection

[0046] In orde...

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Abstract

The invention discloses a non-interlayer discontinuous pressure adding and vacuum diffusion bonding technology for copper and aluminum alloy. The technology comprises the steps of putting copper and aluminum or aluminum alloy test panels ready to be welded in a vacuum chamber of a vacuum diffusion welding device, controlling vacuum degree of the vacuum chamber to be 10 <-4> -10 <-5> Pa, starting a heating procedure, controlling rate of temperature raising to be 5-15 DEG C / min, arranging heat preservation platforms at the temperature of 330-350 DEG C and 520-530 DEG C respectively during the temperature-raising process, wherein the time for heat preservation is 5-10 min; then starting a pressure adding procedure to conduct discontinuous pressure adding, continuing raising the temperature to 570-595 DEG C, conducting heat preservation for 40-60 min, and completing the diffusion bonding. According to the non-interlayer discontinuous pressure adding vacuum diffusion bonding technology for the copper and aluminum alloy, under the condition that no interlayer is added, a pattern of discontinuous pressure adding is adopted, an intermetallic compound formed on a diffusion interface of the copper and the aluminum at a high temperature is then broken and dissolved, structure properties of a joint are then improved, and diffusion combination of heterogeneous metals -copper and aluminum- is thus achieved.

Description

technical field [0001] The invention relates to the field of welding technology, in particular to a non-intermediate layer-free discontinuous pressurized vacuum diffusion connection process of copper and aluminum alloy. Background technique [0002] Both copper and aluminum alloy have good thermal conductivity and electrical conductivity. The connection of the two to form a composite structure can not only meet the special requirements of structure and function, but also reduce the weight of the structure, reduce the cost, and give full play to the characteristics of complementary advantages. However, the oxide film that is easily formed on the surface of the aluminum alloy seriously affects the connection between the two. It is difficult to meet the functional requirements of excellent electrical conductivity by mechanical connection, and the contact at the joint is unstable. In addition, the physical and chemical properties of copper and aluminum alloy are quite different ...

Claims

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Application Information

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IPC IPC(8): B23K20/14B23K20/24B23K103/18
CPCB23K20/14B23K20/24B23K2103/18
Inventor 李亚江刘坤
Owner SHANDONG UNIV
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