Preparation method of nano-silver conductive silver adhesive

Abstract

A preparation method of a nano-silver conductive silver adhesive comprises the following steps: 1, preparing arylic-terminated hyperbranched polyamine-ester (HBP3-MA); 2, preparing arylic-terminated hyperbranched polyamine-ester (HBP3-MA); 3, preparing a mixed solution; 4, preparing a complex; and 5, preparing the modified silicone rubber nano-silver conductive adhesive. Nano-silver is generated in the solidification process in an in-situ manner by using silver acetate as a precursor through the template effect of the HBP3-MA, and low temperature sintering of the surface of silvered copper powder is realized to obtain the nano-silver conductive adhesive with good conductivity.

Description

Technical field [0001] The invention belongs to the field of fine chemicals, and particularly relates to a preparation method of nano silver conductive adhesive. Background technique [0002] Generally speaking, the lower the volume resistivity of the conductive filler, the better the conductivity of the conductive adhesive. Most of the conductive adhesives currently used use silver powder or copper powder as the conductive filler. This is due to the high conductivity of silver and copper. The volume resistivity of silver powder is very low. The silver powder is chemically inert and difficult to be oxidized. The oxide formed after oxidation can also conduct electricity. Therefore, silver powder is an ideal conductive filler. In recent years, the preparation and application of nanoparticles has become a research hotspot. In the process of chemical preparation of nano-silver, there is often the disadvantage that the stabilizers on the surface of the nanoparticles are difficult to r...

AI Technical Summary

Problems solved by technology

[0002] Generally speaking, the lower the volume resistivity of the conductive filler, the better the conductivity of the conductive adhesive. Most of the currently used conductive adhesives use silver powder or copper powder as the conductive filler. This is due to the high conductivity of silver and copper. The volume resistivity of silver powder is very low, and the silver powder is chemically inert, not easy to be oxidized, and the oxide generated after oxidation can also conduct electricity, so silver powder is an ideal conductive filler. In recent years, the preparation and application of nanoparticles have become a research hotspot, common In the process of chemical preparation of nano-silver, there is often the disadvantage that the stabilizers on the surface of nanoparticles are difficult to remove. These stabilizers are coated on the surface of nanoparticles, which reduces the conductivity of nanoparticles and seriously affects the application of nanoparticles in conductive adhesives. , while the in-situ generation of nano-silver in the polymer matrix does not require purification, the cross-linked network structure of the polymer hinders the agglomeration of nanoparticles to a certain extent, so that the generated nanoparticles are uniformly dispersed in the polymer matrix