Rapid measurement circuit of two-dimensional resistive sensing array

Abstract

The invention provides a rapid measurement circuit of a two-dimensional resistive sensing array. The rapid measurement circuit includes a two-dimensional resistive sensing unit array sharing row lines and column lines, a column multipath selector and a scanning controller, one end of each resistive sensing unit in the two-dimensional resistive sensing unit array is connected with a corresponding row line, the other end is connected with a corresponding column line, one end of the resistive sensing unit R<ij> is connected with the y<cj> end of the column multipath selector, the ac1, ac2,..., acN ports of the column multipath selector are connected with test voltage Vin, the scanning controller outputs a scanning control signal to control the column multipath selector, the rapid measurement circuit also includes M rows of resistance sampling circuits to perform one-time measurement on M resistive sensing units in the two-dimensional resistive sensing array, the M rows of resistance sampling circuits include M resistance sampling circuits, and correspond to M rows of the two-dimensional resistive sensing unit array, and each resistance sampling circuit includes an operational amplifier A<mpi> and a resistor R

. The rapid measurement circuit of the two-dimensional resistive sensing array can realize rapid detection.

Description

technical field [0001] The invention relates to a fast measurement circuit of a two-dimensional resistive sensing array, belonging to the technical field of circuits. Background technique [0002] The array sensing device is to combine multiple sensing elements with the same performance according to the structure of a two-dimensional array. It can change or generate corresponding shapes and characteristics by sensing changes in parameters focused on the array. This feature is widely used in biosensing, temperature tactile and thermal imaging based on infrared sensors, etc. [0003] Resistive sensing arrays are widely used in infrared imaging simulation systems, force tactile sensing and temperature tactile sensing. Taking temperature touch as an example, since the temperature sensing device involves the transfer of heat and the perception of temperature, in order to obtain the thermal properties of the object, the device puts forward higher requirements for the temperature ...

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Problems solved by technology

Verification using a 16×16 array network bolometer array, using only 32 pins, has confirmed that the model can effectively resolve device damage or small changes in device value, but it is not suitable for other parameters in the row and column of the device under test. The crosstalk of components does not play a good role in isolation

In 2009, Y.J.Yang et al. proposed a 32×32 array of temperature and tactile sensing arrays for the artificial skin of the robotic arm. A multiplexer was added to the array network, and the speed of row selection and column selection was greatly accelerated. The maximum detection The rate is as high as 3,000 pixels per second, but in order to ensure the detection accurac

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