A Fast Measuring Circuit for Two-dimensional Resistive Sensing Array

Abstract

A fast measurement circuit for a two-dimensional resistive sensing array, including a two-dimensional resistive sensing unit array sharing row lines and column lines, a column multiplexer, and a scan controller, in the two-dimensional resistive sensing unit array One end of each resistive sensing unit is connected to the corresponding row line, and the other end is connected to the corresponding column line. The resistive sensing unit R ij One end of the column multiplexer with the y cj connected side by side, the column multiplexer a c1 、a c2 ,...,a cN port with test voltage V in connected, the scan controller outputs scan control signals to control the column multiplexer, and the fast measurement circuit also includes M row resistance sampling circuits to realize one-time measurement of M resistive sensing units in the two-dimensional resistive sensing array, and the M row The resistance sampling circuit includes M resistance sampling circuits corresponding to M rows of the two-dimensional resistive sensing unit array, and the resistance sampling circuit includes an operational amplifier Amp i and a resistor R Li . The invention can realize rapid detection.

Description

technical field [0001] The invention relates to a fast measurement circuit of a two-dimensional resistive sensing array, belonging to the technical field of circuits. Background technique [0002] The array sensing device is to combine multiple sensing elements with the same performance according to the structure of a two-dimensional array. It can change or generate corresponding shapes and characteristics by sensing changes in parameters focused on the array. This feature is widely used in biosensing, temperature tactile and thermal imaging based on infrared sensors, etc. [0003] Resistive sensing arrays are widely used in infrared imaging simulation systems, force tactile sensing and temperature tactile sensing. Taking temperature touch as an example, since the temperature sensing device involves the transfer of heat and the perception of temperature, in order to obtain the thermal properties of the object, the device puts forward higher requirements for the temperature ...

AI Technical Summary

Problems solved by technology

Verification using a 16×16 array network bolometer array, using only 32 pins, has confirmed that the model can effectively resolve device damage or small changes in device value, but it is not suitable for other parameters in the row and column of the device under test. The crosstalk of components does not play a good role in isolation

In 2009, Y.J.Yang et al. proposed a 32×32 array of temperature and tactile sensing arrays for the artificial skin of the robotic arm. A multiplexer was added to the array network, and the speed of row selection and column selection was greatly accelerated. The maximum detection The rate is as high as 3,000 pixels per second, but in order to ensure the detection accuracy and shield the interference of non-tested resistors in the array, the circuit introduces an operational amplifier circuit in each column of the array. The circuit is complex, and the small difference in the performance of multiple operational amplifiers Also leads to poor consistency of measurement results across multiple channels

However, it does not shield the interference of the internal resistance of the column multiplexer and the adjacent resistance on the column line where the measured resistance is located, and does not realize the adjacent resistance of the row line and the column line where the measured resistance is located. Isolation from internal resistance of row and column multiplexers

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