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Low-melting-point and high-hardness lead-free solder and preparation method thereof

A lead-free solder, high hardness technology, applied in the direction of welding equipment, welding/cutting media/materials, welding media, etc., can solve the problems of poor wettability, low melting point soldering hardness, etc., and achieve good soldering performance.

Inactive Publication Date: 2017-03-22
ANHUI HUAZHONG WELDING MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The invention provides a lead-free solder with low melting point and high hardness and a preparation method thereof, which solves the problems of low hardness and poor wettability of the existing low melting point solder

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] A lead-free solder with low melting point and high hardness, which comprises Zn5, Bi30, Mg0.2, In0.1, graphene 0.01, and the balance is Sn and unavoidable impurities in terms of weight percentage.

[0031] Its preparation method comprises the following steps:

[0032] (1) preparing alloys of raw materials other than graphene in proportion, and pulverizing the prepared alloys to 100-150 orders for subsequent use;

[0033] (2) Graphene is added into alcohol, treated with ultrasonic, ultrasonic power 150W, frequency 80kHz, time 2h;

[0034] (3) Add the graphene alcohol solution and alloy powder after ultrasonic treatment into a high-energy ball mill, 150r / min, 150 degrees of temperature, and grind for 10min;

[0035] (4) drying the graphene and alloy powder mixture after grinding;

[0036] (5) The dried mixture is put into a mold, extruded, and the pressure is 80MPa, and the holding time is 15min;

[0037] (6) Sinter the molded mixed powder at 250°C for 5 hours to obtai...

Embodiment 2

[0039] A lead-free solder with low melting point and high hardness, which comprises Zn7, Bi35, Mg0.3, In0.15, graphene 0.012, and the balance is Sn and unavoidable impurities in terms of weight percentage.

[0040] Its preparation method comprises the following steps:

[0041] (1) preparing alloys of raw materials other than graphene in proportion, and pulverizing the prepared alloys to 100-150 orders for subsequent use;

[0042] (2) Add graphene to alcohol, and use ultrasonic treatment, ultrasonic power 180W, frequency 90kHz, time 2.5h;

[0043] (3) Add the graphene alcohol solution and alloy powder after ultrasonic treatment into a high-energy ball mill, 180r / min, 180 degrees of temperature, and grind for 12min;

[0044] (4) drying the graphene and alloy powder mixture after grinding;

[0045](5) The dried mixture is put into a mold, extruded, and the pressure is 85MPa, and the holding time is 18min;

[0046] (6) Sinter the molded mixed powder at 280°C for 4 hours to obta...

Embodiment 3

[0048] A lead-free solder with low melting point and high hardness, including Zn8, Bi40, Mg0.5, In0.2, graphene 0.015, and the balance is Sn and unavoidable impurities in terms of weight percentage.

[0049] Its preparation method comprises the following steps:

[0050] (1) preparing alloys of raw materials other than graphene in proportion, and pulverizing the prepared alloys to 100-150 orders for subsequent use;

[0051] (2) Graphene is added into alcohol, treated with ultrasonic, ultrasonic power 200W, frequency 100kHz, time 3h;

[0052] (3) Add the graphene alcohol solution and alloy powder after ultrasonic treatment into a high-energy ball mill, 200r / min, 200 degrees of temperature, and grind for 15min;

[0053] (4) drying the graphene and alloy powder mixture after grinding;

[0054] (5) The dried mixture is put into a mold, extruded, and the pressure is 90MPa, and the holding time is 20min;

[0055] (6) Sinter the molded mixed powder at 300°C for 3 hours to obtain le...

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Abstract

The invention relates to a low-melting-point and high-hardness lead-free solder and a preparation method thereof. The low-melting-point and high-hardness lead-free solder is prepared from the following raw materials in percentage by weight: 5 to 8 percent of Zn, 30 to 40 percent of Bi, 0.2 to 0.5 percent of Mg, 0.1 to 0.2 percent of In, 0.01 to 0.015 percent of grapheme, and the balance being Sn and inevitable impurities. According to the low-melting-point and high-hardness lead-free solder disclosed by the invention, by optimizing components of the raw materials and adding the Mg and the grapheme, the hardness of the solder is effectively improved, a melting point is reduced, and the solder is enabled to have good welding performance.

Description

technical field [0001] The invention relates to a lead-free solder with low melting point and high hardness and a preparation method thereof, belonging to the field of magnesium alloy welding materials. Background technique [0002] The traditional solder in the past is tin-lead solder, which has been widely used in the past because of its low melting point, excellent solderability, and low cost. With the rapid development of electronic technology, the replacement time of electronic products is shortened day by day, resulting in a large amount of electronic product waste. Printed circuit boards, removed from disassembled electronics, are often shredded and buried in the ground. If the rainwater seeps into the ground and touches the buried electronic circuit board, the lead in the tin-lead solder will be separated in an ion state and enter rivers, lakes, etc., polluting water sources. If you drink water containing lead for a long time, lead will be deposited in the body, ev...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/40
CPCB23K35/262B23K35/40
Inventor 刘东枭
Owner ANHUI HUAZHONG WELDING MATERIAL CO LTD
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