Ultra-thin uniform-temperature board laser preparation method

Abstract

The invention relates to the technical field of uniform-temperature boards, in particular to an ultra-thin uniform-temperature board laser preparation method. The ultra-thin uniform-temperature board laser preparation method comprises the following steps that (1) pretreatment is conducted, specifically, substrates are cleaned; (2) grooves are prepared, specifically, the grooves are formed in the surfaces of the substrates through laser engraving; (3) the substrates are subjected to surface hydrophilic treatment; (4) welding forming is conducted, specifically, the groove faces of the two substrates are oppositely placed and subjected to laser welding, an inflation opening is reserved, and a formed uniform-temperature board is prepared; and (5) sealing is conducted through welding, specifically, the formed uniform-temperature board is filled with working media and sealed through welding. By adoption of the ultra-thin uniform-temperature board laser preparation method, the engraved grooves are neat and small, and the groove faces of the substrates are subjected to surface hydrophilic treatment, so that evaporation heat absorption and reflux condensation of the working media in the uniform-temperature board are facilitated; and meanwhile, the peripheries of the substrates are subjected to scale laser welding, the welding airtightness is good, and prepared heat pipe clamps are small in size, good in heat transfer performance and small in reflux resistance.

Description

technical field [0001] The invention relates to the technical field of temperature chambers, in particular to a laser preparation method for ultra-thin temperature chambers. Background technique [0002] The vapor chamber is a heat conduction component that relies on the phase change of its internal working fluid to conduct heat. It has excellent characteristics such as high thermal conductivity and excellent isothermal property. It has good heat conduction effect and is widely used. In recent years, the rapid development of electronic technology, the high frequency and high speed of electronic devices and the density and miniaturization of integrated circuits have caused a sharp increase in the heat generation of electronic devices per unit volume. The vapor chamber technology is suitable for solving problems due to its high efficiency, compactness, flexibility and reliability. At present, the heat dissipation problem derived from the performance improvement of electronic d...

AI Technical Summary

Problems solved by technology

However, the grooved vapor chamber has a very obvious disadvantage, that is, the requirements for the depth and width of the groove are very high and the directionality is very strong. The directional characteristic has become a fatal flaw, which will lead to a significant drop in the heat transfer performance of the vapor chamber

[0007] At the same time, due to the traditional method of preparing the vapor chamber, it is often necessary to sinter the liquid-absorbing core or stamp out the groove, but the sintered liquid-absorbing core and the pipe body are not integrally formed, and the return resistance is large, and there is thermal resistance between the pipe itself; stamping The width of the grooved liquid-absorbing core is relatively large, so that the volume of the prepared vapor chamber is large, and it is impossible to realize miniaturization