Large-scale infrared focal plane structure with thermal stress unloading capacity

Abstract

The invention relates to a large-scale infrared focal plane structure with thermal stress unloading capacity, which comprises a detector chip (1) and the like. The detector chip (1) is mounted on sapphire (2); one lateral surface of a first transitional substrate (31) is a plane, a ring-shaped groove is formed at the middle part of the other lateral surface of the first transitional substrate (31), and the sapphire (2) is adhered to the side of the plane of the first transitional substrate (31); one lateral surface of a second transitional substrate (32) is a plane, a ring-shaped convex structure is formed at the middle part of the other lateral surface of the second transitional substrate (32), the convex structure is abutted with the ring-shaped groove of the first transitional substrate (31) to form a cavity, and a sapphire compensation sheet (7) is mounted in the cavity and is adhered to the first transitional substrate (31); and the second transitional substrate (32) is mounted on a cold plate (4). According to the invention, by the stress unloading structure, a thermal stress and thermal deformation which are generated due to mismatching of thermal expansion coefficients of laminated materials are adsorbed, so that the thermal stress and thermal deformation of a large-scale infrared focal plane are effectively reduced, and reliability of a large-scale infrared focal plane device is improved.

Description

technical field [0001] The invention relates to a large-scale infrared focal plane structure form. Background technique [0002] With the development of space infrared remote sensors, the field of view of remote sensors has been continuously enlarged, and the spatial resolution has been continuously improved. Therefore, the scale of infrared detectors is also getting larger and larger. However, limited by the scale of a single-chip detector, usually multiple detectors must be spliced ​​to meet the requirements of use. The size of the focal plane after splicing is relatively large, and it can reach 100-300 mm at present. [0003] Infrared focal plane structure such as figure 1 (a), figure 1 As shown in (b), the infrared focal plane device generally uses a mercury cadmium telluride photovoltaic array to interconnect with the detector chip 1 through flip-chip welding technology, and then sticks it to the sapphire sheet 2, and the sapphire sheet 2 is bonded to the transition ...

AI Technical Summary

Problems solved by technology

This problem is particularly prominent for large focal planes, which may cause damage to the detector material, seriously affecting the life and reliability of the focal plane device

In addition, thermal deformation can also cause the photosensitive surface of the detector to warp, making the detectors not coplanar, thus affecting the imaging quality

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