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High temperature thick film electrode slurry and preparation method thereof

A thick-film electrode and slurry technology, which is applied in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., can solve problems such as unfavorable environmental protection, achieve small square resistance, good bonding, good printing effect

Inactive Publication Date: 2017-04-26
DONGGUAN COREHELM ELECTRONICS MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] It should be further pointed out that the traditional sintered electrode paste contains harmful substances, such as lead and cadmium, which are not conducive to environmental protection

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Embodiment 1, a high-temperature thick-film electrode slurry, including the following materials by weight, specifically:

[0032] Functional Phase 70%

[0033] Inorganic binder phase 5%

[0034] Organic vehicle 25%.

[0035] Among them, the functional phase is a composite powder composed of nano silver powder, micron silver powder and palladium powder. The parts by weight of nanometer silver powder, micron silver powder and palladium powder are 20%, 70% and 10% successively.

[0036] The inorganic bonding phase is lead-free glass-ceramic powder, which is composed of SiO 2 , MgO, B 2 o 3 , ZnO, Bi 2 o3 、Al 2 o 3 , crystal nucleating agent (TiO 2 ) mixture, SiO in the inorganic binder phase 2 , MgO, B 2 o 3 , ZnO, Bi 2 o 3 、Al 2 o 3 、TiO 2 The weight parts of seven kinds of materials are 30%, 13%, 10%, 5%, 40%, 1%, 1% successively.

[0037] The organic carrier is a mixture composed of ethyl cellulose, dibasic acid ester, polymethacrylic acid amine, silic...

Embodiment 2

[0044] Embodiment 2, a high-temperature thick-film electrode slurry, is characterized in that it includes the following materials by weight, specifically:

[0045] Functional Phase 65%

[0046] Inorganic binder phase 8%

[0047] Organic vehicle 27%.

[0048] Among them, the functional phase is a composite powder composed of nano-silver powder, micro-silver powder, and palladium powder. The parts by weight of the three materials of medium and nanometer silver powder, micron silver powder and palladium powder are 25%, 65%, and 10% successively.

[0049] The inorganic bonding phase is lead-free glass-ceramic powder, which is composed of SiO 2 , MgO, B 2 o 3 , ZnO, Bi 2 o 3 、Al 2 o 3 , crystal nucleating agent (TiO 2 ) mixture, SiO in the inorganic binder phase 2 , MgO, B 2 o 3 , ZnO, Bi 2 o 3 、Al 2 o 3 、TiO 2 The weight parts of seven kinds of materials are 28%, 14%, 10%, 6%, 40%, 1%, 1% successively.

[0050] The organic carrier is a mixture composed of polyvi...

Embodiment 3

[0057] Embodiment 3, a high-temperature thick-film electrode slurry, including the following materials by weight, specifically:

[0058] Functional phase 68%

[0059] Inorganic binder phase 4%

[0060] Organic vehicle 28%.

[0061] Among them, the functional phase is a composite powder composed of nano-silver powder, micro-silver powder, and palladium powder. The weight parts of medium and nanometer silver powder, micron silver powder and palladium powder are 15%, 70% and 15% successively.

[0062] The inorganic bonding phase is lead-free glass-ceramic powder, which is composed of SiO 2 , MgO, B 2 o 3 , ZnO, Bi 2 o 3 、Al 2 o 3 , crystal nucleating agent (ZrO 2 ) mixture, SiO in the inorganic binder phase 2 , MgO, B 2 o 3 , ZnO, Bi 2 o 3 、Al 2 o 3 , ZrO 2 The weight parts of seven kinds of materials are 26%, 14%, 10%, 6%, 42%, 1%, 1% successively.

[0063] The organic carrier is a mixture composed of polyvinylpyrrolidone, terpineol, polymethacrylamine, silico...

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Abstract

The invention discloses a high temperature thick film electrode slurry and a preparation method thereof; the high temperature thick film electrode slurry comprises a function phase, an inorganic bonding phase, and an organic carrier; the function phase comprises nano silver powders, micrometer silver powders and palladium powders; the inorganic bonding phase refers to the leadless microcrystalline glass powders formed by SiO2, MgO, B2O3, ZnO, Bi2O3, AL203 and a nucleation agent; the organic carrier refers to a mixture formed by resin, a solvent, a dispersant, an antifoaming agent, a levelling agent, and a thixotropic agent; the high temperature thick film electrode slurry has the following advantages: 1, the slurry can prevent lead and cadmium from harming environment and human body; 2, the slurry can be well bonded with ceramic and a stainless steel substrate, wherein the clunging force is >10N / mm2; 3, the slurry is good in printing property, high in resolution rate and small in sheet resistance; the preparation method comprises the following steps: preparing the inorganic bonding phase, preparing the function phase, preparing the organic carrier and preparing the electrode slurry; the method can effectively prepare the high temperature thick film electrode slurry.

Description

technical field [0001] The invention relates to the technical field of electronic materials, in particular to a high-temperature thick-film electrode slurry and a preparation method thereof. Background technique [0002] Electrode is the carrier of electron collection and conduction, which plays the role of electrode, packaging and interconnection in electronic components. It is usually required to have strong bonding force with the substrate, small square resistance, uniform conductor, good printability, high resolution and stable performance. , environmental protection and long life. [0003] According to the curing method, the electrode paste is divided into two categories: sintered paste and cured conductive adhesive. Among them, the cured conductive adhesive can be further divided into heat-cured conductive adhesive and light-cured conductive adhesive. According to different conductive fillers, electrode paste can be divided into carbon paste, metal paste (precious met...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B13/00
CPCH01B1/22H01B13/00
Inventor 蒋国辉苏冠贤
Owner DONGGUAN COREHELM ELECTRONICS MATERIAL TECH CO LTD