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a cooling device

A technology of heat dissipation device and fins, applied in cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., can solve the problem that air cooling, liquid cooling and other technologies cannot meet the heat dissipation requirements, and achieve good heat dissipation effect. , convenient maintenance and cleaning, increase the effect of disturbance

Active Publication Date: 2019-05-07
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of this, the purpose of the present invention is aimed at the defects that air cooling, liquid cooling and other technologies in the prior art cannot meet the current heat dissipation requirements

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0029] The present invention provides a heat dissipation device. Embodiment 1 is as follows: it includes a primary emitter electrode 1 , a fin body 2 and a casing 3 . In the technical solution provided by the present invention, the fin body 2 is connected to one side inside the housing, and the connection method can be a fixed connection or a movable connection; the discharge end of the first-stage emitter electrode 1 is arranged on the other side of the inside of the housing facing the fin body 2 The non-discharge end of the first-level emitter electrode 1 is connected to the bottom of the heat sink, and the connection method can be a fixed connection; the distance between the discharge end of the first-level emitter electrode 1 and the fin body 2 is 5mm-15mm; the first-level emitter electrode The discharge end of 1 is connected to the fin body 2 with a DC power supply of 4kV-10kV.

[0030] further, figure 1 Example 2 obtained through modification of Example 1.

Embodiment 2

[0031] Embodiment 2 provides a heat dissipation device, which includes a primary emitter electrode 1 , a fin body 2 , a casing 3 and a slidable fixing frame 4 . see figure 1 , in the technical solution provided by the present invention, the fin body 2 is connected to one side inside the shell, and the connection method can be a fixed connection or a movable connection; the discharge end of the primary emitter electrode 1 is located on the other side of the shell inside the Side; the non-discharge end of the primary emitter electrode 1 is connected to the slidable fixing frame 4, and the connection method can be fixed connection or movable connection; the distance between the discharge end of the primary emitter electrode 1 and the fin body 2 is 5mm-15mm; The discharge end of the primary emitter electrode 1 and the fin body 2 are connected with a DC power supply of 4kV-10kV. The slidable fixing frame 4 is arranged inside the casing 3 through the inner surface of the casing 3 a...

Embodiment 3

[0033] Embodiment 3 provides a heat dissipation device, which includes a primary emitter electrode 1 , a fin body 2 , a casing 3 and a slidable fixing frame 4 . see figure 2 , in the technical solution provided by the present invention, the fin body 2 is connected to one side inside the shell, and the connection method can be a fixed connection or a movable connection; the discharge end of the primary emitter electrode 1 is located on the other side of the shell inside the Side; the non-discharge end of the primary emitter electrode 1 is connected to the slidable fixing frame 4, and the connection method can be fixed connection or movable connection; the distance between the discharge end of the primary emitter electrode 1 and the fin body 2 is 5mm-15mm; The discharge end of the primary emitter electrode 1 and the fin body 2 are connected with a 4kV-10kV DC power supply; the material of the shell 3 is epoxy resin or glass fiber, the thickness is 1mm, the width of the shell is...

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PUM

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Abstract

The invention belongs to the field of electronic products, and particularly relates to a heat radiation device. The heat radiation device comprises an outer shell, a fin body and a primary emitting electrode. The fin body is arranged at one side of the interior of the outer shell; the discharging end of the primary emitting electrode which is dead against the fin body is arranged at the other side of the interior of the outer shell; the discharging end of the primary emitting electrode has a first preset distance to the fin body; and a high-voltage DC current is arranged between the primary emitting electrode and the fin body. The heat radiation device can generate ionic wind by directly converting electric energy into air kinetic energy and improves the heat radiation efficiency by combining the ionic wind cooling technology with a fin radiation technology cleverly. Meanwhile, the heat radiation device is simple in structure, small in volume and convenient to disassemble, maintain and clean.

Description

technical field [0001] The invention belongs to the field of electronic equipment, and in particular relates to a heat dissipation device. Background technique [0002] With the rapid development of electronic packaging technology, the structure size of electronic chips continues to shrink, resulting in a continuous increase in power density, electronic components are developing towards high power, high integration, and miniaturization, and power density continues to increase. Other heat dissipation technologies are not enough to meet the heat dissipation requirements. At the same time, the heat dissipation efficiency of air cooling is not high, and there is noise generated by mechanical movement, while the liquid cooling device is large in size and complicated to install. Therefore, innovation is urgently needed to seek advanced heat dissipation technology solutions. [0003] In summary, the purpose of the present invention is to solve the defect that air cooling, liquid co...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/20136H05K7/20409
Inventor 王长宏冯杰陈宏铠黄嘉中杨诗波林琪琪
Owner GUANGDONG UNIV OF TECH
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