High efficiency heat dissipation phase change LED lamp thermal column and heat dissipation structure thereof
A technology of LED lamps and heat dissipation structures, which is applied to semiconductor devices of light-emitting elements, lighting and heating equipment, cooling/heating devices of lighting devices, etc. problem, to achieve the effect of good thermal conductivity and good water absorption
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[0050] As an improved specific embodiment, the water-absorbing layer 2 is a water-absorbing cotton core or a polymer water-absorbing resin.
[0051] Absorbent cotton cores and polymer absorbent resins are widely used as common absorbent materials. Easy to obtain and low cost at the same time.
[0052] As an improved specific embodiment, the graphene layer 4 is graphene paper.
[0053] As an improved specific embodiment, the carbon fiber layer 3 is carbon fiber cloth.
[0054] A heat dissipation structure capable of achieving high-efficiency heat dissipation through all-round adjustments of 360 degrees, including a surrounding board 7 and bottom plates 8 arranged at two openings of the surrounding board 7, one of which is attached with an LED lamp 15, so The surrounding board 7 and the two bottom boards 8 form a cooling cavity 6 , and the heat conduction column 1 is fixed on the bottom board 8 on which the LED lamp 15 is bonded.
[0055] As an improved specific embodiment, i...
Embodiment 1
[0144] In the LED lamp manufactured by the present invention, the area of the bottom of the heat dissipation chamber is a circle with a radius of 5 cm, the height of the heat dissipation chamber is 20 cm, and the heat dissipation chamber is filled with a phase change liquid of 40% solvent, and the phase change liquid is ethanol.
[0145] Overall comparative example 1:
[0146] Compared with the overall embodiment 1, the overall comparative example 1 uses hollow copper tubes for the thermal conduction column.
[0147] Regarding the hollow copper tube and the heat conduction column, a hollow cylinder with a diameter of 0.5cm is selected, six of which are arranged, and the bottom surface of the heat dissipation cavity is used as the center of the circle to form a circular equidistant array, and the distance between the cylinder and the center of the circle is 2.5cm.
[0148] Test: the temperature of the first embodiment, the second embodiment, the third embodiment, the first co...
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