A multi-size chip cutting process

Abstract

The invention discloses a multi-dimension chip cutting technology. The technology comprises the steps that A, photoresist coating and photoetching are performed on the back of a wafer, and double-sided nesting is performed to expose a back silicon substrate corresponding to chip cutting lines; B, deep reactive ions are utilized to etch the silicon substrate material; C, the wafer is subjected to photoresist removal and cleaning; D, multiple layers of metal is sputtered on the back of the wafer; and E, the wafer is subjected to film attachment and disintegration, and chips of all dimensions are separated. According to the technology, the process is simple and efficient, all the chips of different dimensions and even irregular dimensions on the wafer can be cut and separated at a time, higher selectivity is provided for chip design optimization, the success rate of research and development is increased, and cost is lowered; meanwhile, the back and the sidewall of each chip are covered with metal layers, therefore, radio frequency chip power consumption can be reduced, and radio frequency conversion efficiency can be improved.

Description

technical field [0001] The invention belongs to the technical field of microelectronics, and in particular relates to a multi-size chip cutting process. Background technique [0002] In the current semiconductor process technology, chip cutting mainly includes mechanical wafer cutting and laser cutting. These two cutting methods have their own characteristics. For mechanical wafer cutting, it belongs to contact blade cutting, which can cut different materials, but the cutting path is large and can only be cut in a straight line; while laser cutting is a non-contact cutting method, which can be programmed for any Shape cutting, the cutting line is small, but laser cutting can only be applied to specific materials, such as silicon, glass and so on. [0003] In modern chip R&D and design, the process tape-out cost is getting higher and higher. In order to reduce the R&D cost, improve the success rate, and speed up the R&D cycle, on the one hand, it is necessary to design caref...

AI Technical Summary

Problems solved by technology

In addition, in research and development, we will encounter more chips with different functions and different sizes, even rectangular (irregular) chips. After the tape-out of standard process lines is completed, chips of various sizes It will be very difficult to cut and separate each chip

Mechanical wafer cutting can only cut out rectangular chips, and the separation of chips of different sizes depends on the layout method, which is very inefficient, and most of the chips will be lost in general; while laser cutting can be programmed to complete all the different chips on the entire wafer. Dimensional chip cutting, but programming requires precise position coordinates, the process is complicated, the cutting speed is very slow, and the economy is very poor

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