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A kind of preparation method of al-cuzn bimetal conductive material

A conductive material, al-cuzn technology, applied in the direction of conductive materials, conductive materials, metal/alloy conductors, etc., can solve the problems of low bonding strength of Al-Cu composite materials, easy to generate cracks, etc., to achieve improved interface structure, high interface strength, reducing the effect of liquid-solid diffusion ability

Active Publication Date: 2018-07-03
XIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a preparation method of Al-CuZn bimetallic conductive material, which solves the problem that the Al-Cu composite material prepared by the prior art has low bonding strength and cracks are easily generated during use

Method used

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  • A kind of preparation method of al-cuzn bimetal conductive material

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Experimental program
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Effect test

Embodiment 1

[0021] Weigh H62 brass and T2 pure copper with a mass ratio of 1:37, put the H62 brass and pure copper block into the graphite crucible, then put the crucible into the induction melting furnace, and vacuum the induction melting furnace. The vacuum degree in the furnace reaches 3.0×10 -3 Start heating after Pa, when the induced current is below 20A, the current rises by 2A per minute; when the current exceeds 20A, the current rises by 1A per minute; when the current rises to 28A, keep warm for 18 minutes; end the keep warm After that, start to cool down, and the cooling rate is controlled at 2A / min until the current drops to the minimum, and the current is turned off. Then the sample is cooled with the furnace or water-cooled after taking out the sample to obtain a CuZn alloy with a Zn content of 1%.

[0022] Prepare Al-CuZn bimetallic conductive material, process pure aluminum into a cylinder with a size of Φ30mm×20mm, and prepare a CuZn alloy with a size of Φ30mm×30mm;

[0...

Embodiment 2

[0026] Weigh the H62 brass and pure copper block with a mass ratio of 1:24, put the H62 brass and pure copper block into the graphite crucible, then put the crucible into the induction melting furnace, and vacuum the induction melting furnace. The vacuum degree in the furnace reaches 3.0×10 -3 Start heating after Pa, when the induced current is below 20A, the current rises by 2A per minute; when the current exceeds 20A, the current rises by 1A per minute; when the current rises to 28A, keep warm for 18 minutes; end the keep warm After that, start to cool down, and the cooling rate is controlled at 2A / min until the current drops to the minimum, and the current is turned off. Then the sample is cooled with the furnace or water-cooled after taking out the sample to obtain a CuZn alloy with a Zn content of 1.5%.

[0027] Prepare Al-CuZn1.5 bimetal conductive material, process pure aluminum into a cylinder with a size of Φ30mm×20mm, and prepare CuZn1.5 alloy with a size of Φ30mm×3...

Embodiment 3

[0031] Weigh the H62 brass and pure copper block with a mass ratio of 1:11, put the H62 brass and pure copper block into the graphite crucible, then put the crucible into the induction melting furnace, and vacuum the induction melting furnace. The vacuum degree in the furnace reaches 3.0×10 -3Start heating after Pa, when the induced current is below 20A, the current rises by 2A per minute; when the current exceeds 20A, the current rises by 1A per minute; when the current rises to 28A, keep warm for 18 minutes; end the keep warm After that, start to cool down, and the cooling rate is controlled at 2A / min until the current drops to the minimum, and the current is turned off. Then the sample is cooled with the furnace or water-cooled after taking out the sample to obtain a CuZn alloy with a Zn content of 3%.

[0032] Prepare Al-CuZn3 bimetallic conductive material, process pure aluminum into a cylinder with a size of Φ30mm×20mm, and prepare a CuZn3 alloy with a size of Φ30mm×30m...

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Abstract

The invention discloses a preparation method of an Al-CuZn bimetallic conducting material. The preparation method of the Al-CuZn bimetallic conducting material comprises the steps that firstly, CuZn alloy is prepared through induction smelting; secondly, an aluminum block and the CuZn alloy are pretreated; and finally, the pretreated aluminum block and the pretreated CuZn alloy are placed into a hot-pressing grinding tool for vacuum hot-pressing sintering, and thus the Al-CuZn bimetallic conducting material is obtained. According to the preparation method of the Al-CuZn bimetallic conducting material, by adding Zn into copper, the lattice constant and other properties of copper are changed, the liquid-solid diffusivity of pure copper and aluminum on an interface is reduced, generation of intermetallic compounds including CuAl2 and Cu4Al9 is restrained, and the interface structure of the Al-CuZn bimetallic material is improved; by means of the different melting points of aluminum and copper, it is guaranteed that the pure aluminum with the molten surface and the solid CuZn alloy form a good transition interface through diffusion under the high-temperature condition, and metallurgical bonding of aluminum and the CuZn alloy is achieved.

Description

technical field [0001] The invention belongs to the technical field of bimetallic composite material preparation, and in particular relates to a method for preparing an Al-CuZn bimetallic conductive material. Background technique [0002] The connection of Al-Cu dissimilar metals is widely used in metallurgy, electric power, chemical industry, refrigeration and aerospace industries. At present, methods such as melting and casting, explosive welding, and friction stir welding are mainly used to realize the connection of Al-Cu bimetals. However, since the melting points of Al and Cu differ by 424°C, the linear expansion coefficients differ by more than 40%, and the electrical conductivity also differs by more than 70%, and both Al and Cu are active metal elements that are easily oxidized, during the welding process, the two Metals are not only easy to form metal oxides, but also very easy to generate CuAl at the interface 2 , Cu 4 al 9 Such as intermetallic compounds, these...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C1/00C22C1/02H01B13/00H01B1/02
CPCC22C1/00C22C1/02H01B1/02H01B1/023H01B1/026H01B13/00H01B13/0016
Inventor 邹军涛李思林梁淑华魏艳妮罗永光卢正欣钟黎声
Owner XIAN UNIV OF TECH
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