Environment-friendly low-temperature sintered high-heat-conduction dielectric paste and preparation method therefor

Abstract

The invention discloses environment-friendly low-temperature sintered high-heat-conduction dielectric paste and a preparation method therefor. The dielectric paste is prepared from the following materials based on weight percentages: 5-30% of low-melting-point glass powder, 10-60% of high-heat-conduction filler and 15-60% of organic binding phase; and the organic binding phase is prepared from the following materials based on weight percentages: 5-50% of resin, 10-90% of solvent and 0.8-21% of auxiliaries. The dielectric paste has the following advantages as follows: 1, no environmental pollution content and achieving a good environmental protection effect; 2, comprising low-melting-point glass powder and having low-temperature sintering characteristic; and 3, by virtue of the added high-heat-conduction filler, achieving a high heat conduction effect; the preparation method comprises the following technological steps of 1, preparing the low-melting-point glass powder; 2, preparing the organic binding phase; and 3, preparing the dielectric paste; and by adoption of the preparation method, the environment-friendly low-temperature sintered high-heat-conduction dielectric paste can be effectively produced and prepared.

Description

technical field [0001] The invention relates to the technical field of electronic materials, in particular to an environment-friendly low-temperature sintered high thermal conductivity medium slurry and a preparation method thereof. Background technique [0002] Dielectric paste is the basic material for the manufacture of thick film heating elements. It is a paste made of low-melting glass powder, organic binders and additives that are uniformly mixed by three-roll rolling (reminiscent of toothpaste, paint, etc.). For the dielectric slurry, on the one hand, it can be used as a transition layer between the substrate of the heating element and the electrothermal function layer to relieve interlayer stress and improve the bonding strength between the electric heating unit and the substrate; The packaging material ensures the insulation of the surface of the heating element and improves its heating uniformity and heat transfer speed. [0003] There are a variety of dielectric ...

AI Technical Summary

Problems solved by technology

[0003] There are a wide variety of dielectric paste products in the prior art; however, there are few reports on low-temperature dielectric pastes, especially high thermal conductivity properties of high-temperature resistant flexible heating films