The invention discloses a 
sapphire wafer polishing method based on fixed 
abrasive tool containing 
neodymium compounds and soft 
abrasive materials. The method comprises the steps that 1), the fixed 
abrasive tool containing the 
neodymium compounds and the soft abrasive materials is prepared by comprising, 40%-60% of 
nano silicon dioxide, 20%-40% of a binding agent, 10%-15% of a curing agent, 5%-10%of a 
neodymium compound, and the balance deionized water; 2), the prepared raw materials undergo hot-press forming in a mould, 
heat curing is completed after demolding is carried out, and the upper end surface and the lower end surface of the formed abrasive tool are trimmed; 3), the abrasive tool is arranged on a 
polishing machine upper disc, a 
sapphire wafer to be machined is placed on a 
polishing machine lower disc capable of rotating and is fixed by a clamp, then a polishing 
machine is started, a water-based cooling liquid is injected between the upper disc and the lower disc, the neodymium compounds and the 
silicon dioxide abrasive particles on the abrasive tool scratch the 
sapphire surface and the 
solid-
phase reaction is carried out, so that the 
sapphire wafer is polished. Accordingto the method, the removal rate of the 
sapphire wafer can be improved, the roughness can be reduced, the 
machining efficiency can be improved, and the production cost can be reduced.