Solder paste for signal processing substrate and preparation method thereof
A signal processing substrate and solder paste technology, applied in the direction of manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problems of reduced wettability of solder powder, easy oxidation, and increased manufacturing cost of solder paste
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[0021] The invention provides a method for preparing a solder paste for a signal processing substrate, comprising:
[0022] 1) Mixing Sn-Zn alloy, copper, indium, chloroauric acid tetrahydrate, polyvinylpyrrolidone, reducing agent and water for contact reaction to prepare an activated metal composition;
[0023] 2) heating and dissolving rosin, rosin amine, organic acid, imidazole, and tris(2-carboxyethyl)isocyanurate to obtain mixed solution I;
[0024] 3) mixing the mixed solution I, the thixotropic agent and the preservative, and then cooling to obtain the mixed solution II;
[0025] 4) mixing liquid II with polyethylene glycol to prepare soldering flux;
[0026] 5) Refrigerating the soldering flux; then, in the presence of X-rays, disperse and mix it with the activated metal composition under vacuum to prepare a solder paste for signal processing substrates.
[0027] In step 1) of the method, the amount of each material can be selected in a wide range. On the premise of ...
Embodiment 1
[0044] 1) Sn-Zn alloy (containing 88% by weight of tin and 12% by weight of zinc), copper, indium, chloroauric acid tetrahydrate, polyvinylpyrrolidone (weight average molecular weight is 2500), reducing agent (sodium citrate) Mix with water according to the weight ratio of 100:0.7:2.4:13:12:13:180, and conduct a contact reaction at 80°C for 4 hours to prepare an activated metal composition;
[0045] 2) Mix rosin, rosin amine, organic acid (malic acid), imidazole, and tris(2-carboxyethyl)isocyanurate in a weight ratio of 100:35:20:13:7, and heat at 155°C Heating and dissolving for 70min to prepare mixed solution I;
[0046] 3) Mix the mixed solution I, the thixotropic agent (fumed silica) and the preservative (sodium nitrite) according to the weight ratio of 100:19:22, and then cool to 25°C to prepare the mixed solution II;
[0047] 4) Mix the mixed solution II with polyethylene glycol (100:11 by weight) to prepare flux;
[0048] 5) The flux was refrigerated at 3°C for 17 h...
Embodiment 2
[0050] 1) Sn-Zn alloy (containing 85% by weight of tin and 15% by weight of zinc), copper, indium, chloroauric acid tetrahydrate, polyvinylpyrrolidone (weight average molecular weight is 1500), reducing agent (sodium citrate) Mix with water in a weight ratio of 100:0.3:2:10:8:10:150, and conduct a contact reaction at 75°C for 2 hours to prepare an activated metal composition;
[0051] 2) Mix rosin, rosin amine, organic acid (salicylic acid), imidazole, and tris(2-carboxyethyl)isocyanurate in a weight ratio of 100:30:15:9:3, and heat at 145°C Under heating and dissolving for 50min to obtain mixed solution I;
[0052] 3) Mix the mixed solution I, the thixotropic agent (fluorobentonite) and the preservative (hydroquinone) according to the weight ratio of 100:18:17, and then cool to 15°C to prepare the mixed solution II;
[0053] 4) Mix the mixed solution II with polyethylene glycol (100:7 by weight) to prepare flux;
[0054] 5) The flux was refrigerated at 1°C for 15 hours; the...
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