Lead-free solder paste for needle cylinder and preparation method

A lead-free solder paste and syringe technology, which is used in welding equipment, welding media, manufacturing tools, etc., can solve the problem of not ensuring stable connector spot-coating welding, and the needle-free lead-free solder paste is not delicate and has poor adhesion. Easy to drop and other problems, to achieve the effect of excellent thixotropic performance, good continuous performance, and not easy to oxidize and discolor

Active Publication Date: 2012-07-04
惠州市斯泰尔科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing lead-free solder paste in syringes is not fine, the dispensing is uneven, the tin is not smooth, and the tin is easy to break. For needles as thin as 0.15mm, it cann

Method used

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  • Lead-free solder paste for needle cylinder and preparation method
  • Lead-free solder paste for needle cylinder and preparation method
  • Lead-free solder paste for needle cylinder and preparation method

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0026] Example 1

[0027] Add 25g of diethylene glycol monobutyl ether, 25g of tetraethylene glycol dimethyl ether and 9g of polyoxyethylene glyceryl ether to the temperature-controlled emulsifier for heating, and stir at 120℃ for 10 minutes at a speed of 200r / min. 15g of polymerized rosin 604#, 7g of polymerized rosin 105# and 7.4g of super hydrogenated rosin AX-E were added in sequence and stirred at 800r / min for another 10 minutes to prepare a mixed solution; then the mixed solution was cooled to a temperature of 100°C, successively Add 1.2g of 2,3-dibromo 1,4-butenediol, 3.0g of sebacic acid and 2.05g of succinic acid, and then stir at 1000r / min for 10 minutes to prepare a secondary mixed solution that is cooled to 75℃ Temperature, add 2.5g modified hydrogenated castor oil and 2.5g polyamide wax in turn, then stir at 1000r / min for 5 minutes to prepare three mixed solutions. Cool down to 50℃, add 0.05g fluorocarbon surfactant in turn FC-4430 and 0.3g triethanolamine were stir...

Example Embodiment

[0028] Example 2

[0029] Add 30g of diethylene glycol monobutyl ether, 15g of tetraethylene glycol dimethyl ether and 10g of polyoxyethylene glyceryl ether to the temperature-controlled emulsifier for heating. Stir at a temperature of 125°C at a speed of 200r / min for 5 minutes, and then add 18.5 g polymerized rosin 604#, 5g polymerized rosin 105#, and 10g of super hydrogenated rosin AX-E were added in sequence and stirred at 800r / min for 5 minutes to prepare a mixed solution; then the mixed solution was cooled to a temperature of 105℃ and added in sequence 1.5g 2,3-dibromo 1,4-butenediol, 2.0g sebacic acid and 3.0g succinic acid, and then stirred at a speed of 1000r / min for 10 minutes, the temperature of the secondary mixed solution was cooled to 70℃ , Add 1.0g modified hydrogenated castor oil, 3.0g polyamide wax in turn, and then stir at 1000r / min for 10 minutes to prepare a three-time mixed solution. Cool down to 55℃, add 0.2g fluorocarbon surfactant FC in sequence -4430 and ...

Example Embodiment

[0030] Example 3

[0031] Add 27.4g of diethylene glycol monobutyl ether, 20g of tetraethylene glycol dimethyl ether and 7g of polyoxyethylene glyceryl ether to the temperature-controlled emulsifier for heating, and stir for 10 minutes at a temperature of 120°C at a speed of 200r / min. Add 19g of polymerized rosin 604#, 8g of polymerized rosin 105# and 8g of special-grade hydrogenated rosin AX-E in sequence and stir at 800r / min for another 10 minutes to prepare a mixed solution; then cool the mixed solution to a temperature of 100°C in sequence Add 1.0g of 2,3-dibromo 1,4-butenediol, 3.0g of sebacic acid and 2.0g of succinic acid, and then stir at 1000r / min for 10 minutes to prepare a secondary mixed solution and cool down to 75℃ Temperature, add 2.0g modified hydrogenated castor oil and 2.0g polyamide wax successively, and then stir at 1000r / min for 5 minutes to prepare three mixed solutions. Cool down to 50℃, add 0.1g fluorocarbon surfactant in turn FC-4430 and 0.5g triethanola...

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Abstract

The invention relates to lead-free solder paste for a needle cylinder and a preparation method. The lead-free solder paste is characterized by comprising lead-free electronic grade tin alloy powder and flux, diethylene glycol monobutyl ether, tetraethylene glycol dimethyl ether and polyoxyethylene glycerin ether are sequentially added into a temperature control emulsifying machine and are heated and mixed, polymerized rosin 604#, polymerized rosin 105# and hydrogenated rosin are added into the temperature control emulsifying machine and are mixed to obtain primary mixed liquor, the primary mixed liquor is cooled, 2,3-dibromo 1,4-butylene glycol, sebacic acid and butanedioic acid are added into the primary mixed liquor and then are mixed to obtain secondary mixed liquor, the secondary mixed liquor is cooled, modified hydrogenated castor oil and polyamide wax are added into the secondary mixed liquor and then are mixed to obtain tertiary mixed liquor, the tertiary mixed liquor is cooled, fluorocarbon surfactant and triethanolamine are added into the tertiary mixed liquor and then are mixed and vacuumized until the temperature returns to room temperature, the tin alloy powder Sn42Bi58 is added into the prepared flux after standing for 24 hours at the temperature of 22-25 DEG C, and the tin alloy powder and the flux are mixed by a double-planet solder paste mixer to obtain the lead-free solder paste for the needle cylinder. The lead-free solder paste has the advantages of superior environmental friendliness, excellent dry resistance, fine thixotropy and fine uniformity.

Description

technical field [0001] The invention relates to a syringe lead-free solder paste, which is suitable for soldering process or secondary reflow process requiring lower temperature, and belongs to lead-free solder. [0002] The invention also relates to a preparation method of the syringe lead-free solder paste. technical background [0003] The existing lead-free solder paste in syringes is not fine, the dispensing is uneven, the tin is not smooth, and the tin is easy to break. For needles as thin as 0.15mm, it cannot guarantee stable connector dispensing and welding for more than 8 hours, and the anti-slump performance Poor, the solder paste has poor adhesion after baking and is easy to fall off. Contents of the invention [0004] The purpose of the present invention is to overcome the shortcomings and deficiencies of the above-mentioned prior art, in accordance with the IEC halogen-free standard, the European Union "RoHS" standard and the American IPM-650, to provide a pa...

Claims

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Application Information

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IPC IPC(8): B23K35/363
Inventor 胡玉朱君竺周志峰
Owner 惠州市斯泰尔科技有限公司
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