Patents
Literature
Patsnap Eureka AI that helps you search prior art, draft patents, and assess FTO risks, powered by patent and scientific literature data.

4results about How to "Good barrier" patented technology

A photovoltaic panel, photovoltaic assembly

ActiveCN224386030UImprove anti-PID performanceGood barrier
The utility model discloses a photovoltaic panel and photovoltaic module are applied to photovoltaic technical field, and photovoltaic panel includes the front glass, cell piece and back glass of laminated arrangement, and the front glass includes: front glass body and first front film layer, and first front film layer is located the side of front glass body close to cell piece, and back glass includes: back glass body and first back film layer, and first back film layer is located the side of back glass body close to cell piece, and first front film layer and / or first back film layer include laminatedly arranged first barrier layer and second barrier layer, and first barrier layer is close to cell piece setting, and the refractive index of first barrier layer is less than the refractive index of second barrier layer. The photovoltaic panel provided by the utility model has the function of increasing the penetration for the light entering the inside of photovoltaic panel, improves the utilization of light energy, has the good blocking effect to the metal ions such as sodium ion, calcium ion from glass, and improves the PID resistance of the photovoltaic panel.
Owner:CHINT NEW ENERGY TECH CO LTD

Semiconductor structure and corresponding chip and product

The invention discloses a semiconductor structure and a corresponding chip and product. The structure comprises a silicon-based integrated circuit and a bump structure arranged on the silicon-based integrated circuit. The bump structure sequentially comprises a UBM layer, a copper conductor layer, a nickel conductor layer and a gold conductor layer. The exposed side walls of the UBM layer, the copper conductor layer and the nickel conductor layer are coated with a metal protection layer composed of palladium, palladium alloy, platinum or platinum alloy, and the protection layer does not cover the gold conductor layer. According to the preparation method, the step-shaped side wall is formed through etching steps in a specific sequence, selective self-growth of the protective layer on the titanium / copper / nickel side wall is achieved through chemical plating based on metal equilibrium potential difference, and the protective layer is not deposited on the gold surface. The problems of poor welding and short circuit caused by oxide generated by side wall oxidation and copper diffusion of the copper-nickel-gold bump are effectively solved, the long-term reliability is remarkably improved, meanwhile, the using amount of precious metal is small, the technology is ingenious, and the method is particularly suitable for the high-end display field of liquid crystal driving chips and the like.
Owner:SHENZHEN UNITED BLUEOCEAN APPLIED MATERIAL TECHNOLOGY CO LTD

Preparation method of diffusion barrier layer for three-dimensional packaging

The present invention relates to the field of semiconductor three-dimensional packaging technology, in particular, to a preparation method for a diffusion barrier layer for three-dimensional packaging, which includes: melting a high entropy alloy, the high entropy alloy having a face-centered cubic structure; rolling the high entropy alloy, the total reduction is 80-90%, annealing at the recrystallization temperature of the high entropy alloy after rolling, and air cooling; cutting to obtain a high entropy alloy patch with a thickness of 1-3 μm; melting the tin ball by a ball planting reflow method, and fusing it with a copper column to form a solder ball; hot-pressing the high entropy alloy patch and the solder ball under hot pressing conditions, the temperature of the hot pressing bonding is 250-270 ° C, the pressure is 200-300 gf, and the time is 20-30 min. The diffusion barrier layer obtained by the preparation method has a good barrier effect.
Owner:HUAMAO ZHIXIN INTEGRATED ELECTRONICS (JIANGSU) CO LTD +1

A device for increasing rooftop photovoltaic safety

ActiveCN113431271Bimprove securityReduce delivery volumePhotovoltaic supportsSolar heating energy
The present invention discloses a device for increasing the safety of rooftop photovoltaics, which belongs to the field of photovoltaic power generation technology. It includes a partition device arranged between the edge of the photovoltaic panel and the roof, and a passage for air circulation is provided between the partition devices on opposite sides. By providing a partition device between the photovoltaic panel and the roof, the oxygen delivery in the flame area is reduced when the building is on fire, the combustion equivalence ratio is reduced, and the flame propagation speed is limited, the chimney effect caused by the restricted space generated by the installation of photovoltaic panels is reduced, and the safety of the building is improved. At the same time, there is a passage for air circulation between the partition devices on opposite sides, which can allow a certain amount of natural wind to enter between the photovoltaic panel and the roof for heat exchange, reduce the surface temperature of the photovoltaic panel, and improve the power generation efficiency.
Owner:HUANENG CLEAN ENERGY RES INST