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Sapphire wafer polishing method based on fixed abrasive tool containing neodymium compound and soft abrasive materials

A sapphire wafer and neodymium technology, applied in the field of polishing, can solve the problems of low polishing efficiency and high cost of sapphire wafers, achieve good polishing effect, improve processing quality, and improve polishing efficiency

Inactive Publication Date: 2018-04-24
ZHEJIANG UNIV OF TECH
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to overcome the shortcomings of low polishing efficiency and high cost of existing sapphire wafers. The present invention provides a fixed abrasive tool based on soft abrasives containing neodymium that has good surface quality, high processing efficiency and low production cost. Sapphire Wafer Polishing Method

Method used

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  • Sapphire wafer polishing method based on fixed abrasive tool containing neodymium compound and soft abrasive materials
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  • Sapphire wafer polishing method based on fixed abrasive tool containing neodymium compound and soft abrasive materials

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Embodiment Construction

[0026] The present invention will be further described below in conjunction with the accompanying drawings.

[0027] refer to Figure 1 ~ Figure 3 , a kind of sapphire wafer polishing method that contains the soft abrasive fixed grinding tool of neodymide, described polishing method comprises the following steps:

[0028] 1) Preparation of raw materials for soft abrasive fixed abrasives containing neodymium: 40% to 60% of nano-silica, 20% to 40% of binder, 10% to 15% of curing agent, and 5% to 10% of neodymium , the rest is deionized water;

[0029] 2) Production of fixed abrasives with soft abrasives containing neodymium: add curing agent to deionized water, stir to dissolve, then add binder, nano-silica, and neodymium, and stir evenly; The ingredients are hot-pressed and formed in the mould, and the heat curing is completed after demoulding, and the upper and lower end surfaces are trimmed to ensure the flatness and parallelism of the upper and lower end surfaces of the ab...

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Abstract

The invention discloses a sapphire wafer polishing method based on fixed abrasive tool containing neodymium compounds and soft abrasive materials. The method comprises the steps that 1), the fixed abrasive tool containing the neodymium compounds and the soft abrasive materials is prepared by comprising, 40%-60% of nano silicon dioxide, 20%-40% of a binding agent, 10%-15% of a curing agent, 5%-10%of a neodymium compound, and the balance deionized water; 2), the prepared raw materials undergo hot-press forming in a mould, heat curing is completed after demolding is carried out, and the upper end surface and the lower end surface of the formed abrasive tool are trimmed; 3), the abrasive tool is arranged on a polishing machine upper disc, a sapphire wafer to be machined is placed on a polishing machine lower disc capable of rotating and is fixed by a clamp, then a polishing machine is started, a water-based cooling liquid is injected between the upper disc and the lower disc, the neodymium compounds and the silicon dioxide abrasive particles on the abrasive tool scratch the sapphire surface and the solid-phase reaction is carried out, so that the sapphire wafer is polished. Accordingto the method, the removal rate of the sapphire wafer can be improved, the roughness can be reduced, the machining efficiency can be improved, and the production cost can be reduced.

Description

technical field [0001] The invention relates to a polishing method, in particular to a high-efficiency and high-quality polishing method for sapphire wafers. Background technique [0002] Sapphire, also known as white sapphire, has the same optical and mechanical properties as natural gemstones, has good thermal properties, excellent electrical and dielectric properties, and is resistant to chemical corrosion. It has a high transmittance to infrared rays and has great Good wear resistance, hardness second only to diamond, Mohs grade 9, still has good stability at high temperature, melting point is 2030 degrees Celsius, is widely used in industry, national defense, scientific research and other fields, more and more It is used as a manufacturing material for parts in high-tech fields such as solid-state lasers, infrared windows, substrates for semiconductor chips, and precision wear-resistant bearings, such as infrared windows for ground-to-ground and surface-to-air missiles,...

Claims

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Application Information

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IPC IPC(8): B24B1/00B24B55/02B24D18/00
CPCB24B1/00B24B55/02B24D18/0009
Inventor 吕冰海张韬杰邓乾发杭伟曹霖霖陈芝向黄晟
Owner ZHEJIANG UNIV OF TECH
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