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Surface treatment of semiconductor sensors

A technology of sensors and sensor components, applied in the direction of instruments, scientific instruments, measuring devices, etc., can solve problems such as hindering or restricting analytes, no data, and reduced effectiveness of sensor arrays

Active Publication Date: 2017-05-17
LIFE TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such altered surface chemistry can prevent or limit capture of analytes near the sensor
Consequently, the utility of such sensor arrays is reduced and signals generated by such sensor arrays may include erroneous or no data

Method used

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  • Surface treatment of semiconductor sensors
  • Surface treatment of semiconductor sensors
  • Surface treatment of semiconductor sensors

Examples

Experimental program
Comparison scheme
Effect test

example

[0063] Sensor assemblies were prepared using butylammonium trimethoxysilane (BATS) according to the following protocol. BATS was obtained from GELEST, part number SIT8422.0.

[0064] Chips were treated with dodecylbenzenesulfonic acid (DB SA).

[0065] Attachment port expander

[0066] Undecane containing 5% DBSA (100 μL) for 2 min at 50 °C (solution prepared fresh daily, stored at 50 °C)

[0067] 2 x 200 μL isopropanol (IPA) washes

[0068] 1 x 200 μL nanofiltered (NF) water wash

[0069] 1min 100mM NaOH (200μL)

[0070] 1 x 200 μL NF water for washing

[0071] 1 x 200 μL IPA wash

[0072] Remove the port extender and remove the IPA under vacuum

[0073] Repeat two more times for a total of 3 cycles of DBSA / NaOH.

[0074] Prepare a 5% BATS solution. To prepare 1 mL of solution: 200 μL BATS (25% in DMF) with 750 μL absolute ethanol and 50 μL NF water.

[0075] The DBSA washed chips were placed in 4oz jars equipped with 1.5mL tubes filled with 95% EtOH.

[0076] Add ...

example 2

[0084] Using the following protocol, the sensor assembly (ION Torrent from Life Technologies Corporation) TM Proton II) was treated with imidazole phosphate (ImPA). ImPA solution consisted of 50% isopropanol / 50% diH20 containing 5 mg / mL ImPA.

[0085] to clean

[0086] 1. Place the chip on a hot plate at 50°C and allow it to warm up briefly (about 30 seconds).

[0087] 2. Add 100 μL of 5% DBSA solution.

[0088] 3. Incubate for 5 minutes.

[0089]4. Wash the chip with 2 x 200 [mu]L fractions of undecane.

[0090] 5. Wash chip with IPA, dry by vacuum suction (or nitrogen flow if vacuum is not available).

[0091] ImPA deposition

[0092] 1. Place the cleaned and dried chip on a heating plate at 50°C and allow it to warm up briefly.

[0093] 2. Load enough ImPA solution to fill the flow cell and both ports (about 150 μL)

[0094] 3. Incubate for 10 minutes.

[0095] 4. Empty the port by vacuum aspiration (or pipetting if vacuum is not available).

[0096] 5. Wash the c...

example 3

[0099] Using the following protocol, the sensor assembly (obtained from ION Torrent from Life Technologies TM Proton II) was treated with trimethoxyammonium 12-dodecylphosphonate (MAPA). MAPA solution included 5mg / mL ImPA in diH2O.

[0100] cleaning-

[0101] 1. Place the chip on a hot plate at 50°C and allow it to warm up briefly (about 30 seconds).

[0102] 2. Add 100 μL of 5% DBSA solution.

[0103] 3. Incubate for 5 minutes.

[0104] 4. Wash the chip with 2 x 200 [mu]L fractions of undecane.

[0105] 5. Remove the chip from the heating plate and rinse with 200 [mu]L undecane.

[0106] 6. Rinse the chip with 2×200 μL IPA, followed by 200 μL ultrapure water.

[0107] 7. Wash chip with IPA, dry by vacuum suction (or nitrogen flow if vacuum is not available).

[0108] MAPA deposition-

[0109] 1. Prepare a 5 mg / mL aqueous solution (MAPA: Trimethoxyammonium 12-dodecylphosphonate SIK7722-10). Briefly sonicate the solution to completely dissolve the MAPA solid.

[0110]...

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Abstract

A sensor component includes a sensor including a sensor surface and a reaction site in cooperation with the sensor and exposing the sensor surface. The reaction site including a reaction site surface. A surface agent is bound to the reaction site surface or the sensor surface. The surface agent includes a surface active functional group reactive with Bronsted base or Lewis acid functionality on the reaction site surface or the sensor surface and including distal functionality that does not have a donor electron pair.

Description

technical field [0001] The present disclosure generally relates to systems and methods for processing surfaces of semiconductor sensors and processed semiconductor sensors. Background technique [0002] Sensor arrays formed in semiconductor substrates are increasingly used in fields such as analytical chemistry and molecular biology. For example, when an analyte is captured on or near a sensor pad of a sensor array, the analyte or by-product of a reaction associated with the analyte can be detected and used to interpret information about the analyte. Specifically, such sensor arrays have been used in genetic analysis, such as gene sequencing or quantitative amplification. [0003] During fabrication, various semiconductor processing techniques can alter the properties of the surface of the sensor array and the surface of the well structures surrounding the sensor array. Such processing can also leave residues on the surface or alter surface oxidation. Such altered surface...

Claims

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Application Information

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IPC IPC(8): G01N27/414
CPCG01N27/4145
Inventor R.L.西塞罗M.格雷泽Y.王C.E.英曼J.格雷J.科斯辛斯基J.鲍尔P.瓦戈纳A.马斯特罗扬尼
Owner LIFE TECH CORP