High-performance heat-conducting silica gel and preparation method thereof
A thermally conductive silicon and high-performance technology, applied in the field of high-performance thermally conductive silicone gel and its preparation, can solve the problems of reduced protection of components, reduced material elasticity and toughness, etc., to achieve lasting elasticity and toughness, improve heat resistance, Guaranteed quality reliability and service life effect
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[0041] Example 1 High-performance thermal conductive silicone gel
[0042] A high-performance thermally conductive silicone gel of this embodiment, said silicone gel is prepared from component A and component B with a mass ratio of 1:1; said component A:
[0043] Vinyl-terminated silicone oil (vinyl content 0.3wt%) 16g
[0044] Alumina filler (particle size 8~10um) 84g
[0045] Platinum catalyst (3200ppm) 0.002g
[0046] The B component is composed of the following raw materials in weight percentage:
[0047]
[0048] The preparation method of a high-performance thermal conductive silicone gel of this embodiment includes the following steps:
[0049] 1) Preparation of component A: mix the base material, thermally conductive filler, and catalyst evenly to obtain;
[0050] 2) Preparation of component B: mix the base material, thermally conductive filler, terminal hydrogen-containing silicone oil, crosslinking agent, and inhibitor uniformly to obtain the component B; wherein the preparation m...
Example Embodiment
[0056] Example 2 High-performance thermal conductive silicone gel
[0057] The high-performance thermally conductive silicone gel of this embodiment is prepared from component A and component B with a mass ratio of 1:1; said component A:
[0058] Vinyl-terminated silicone oil (vinyl content 0.3wt%) 18g
[0059] Alumina filler (particle size 8~10um) 82g
[0060] Platinum catalyst (3200ppm) 0.002g
[0061] The B component consists of the following raw materials by weight percentage:
[0062]
[0063] The preparation method of a high-performance thermal conductive silicone gel of this embodiment includes the following steps:
[0064] 1) Preparation of component A: mix the base material, thermally conductive filler, and catalyst evenly to obtain;
[0065] 2) Preparation of component B: mix the base material, thermally conductive filler, terminal hydrogen-containing silicone oil, crosslinking agent, and inhibitor uniformly to obtain the component B; wherein the preparation method of the crossli...
Example Embodiment
[0071] Example 3 High-performance thermal conductive silicone gel
[0072] The high-performance thermally conductive silicone gel of this embodiment is prepared from component A and component B with a mass ratio of 1:1; said component A:
[0073] Vinyl-terminated silicone oil (vinyl content 0.3wt%) 15g
[0074] Alumina filler (particle size 8~10um) 85g
[0075] Platinum catalyst (3200ppm) 0.002g
[0076] The B component consists of the following raw materials by weight percentage:
[0077]
[0078] The preparation method of a high-performance thermal conductive silicone gel of this embodiment includes the following steps:
[0079] 1) Preparation of component A: mix the base material, thermally conductive filler, and catalyst evenly to obtain;
[0080] 2) Preparation of component B: mix the base material, thermally conductive filler, terminal hydrogen-containing silicone oil, crosslinking agent, and inhibitor uniformly to obtain the component B; wherein the preparation method of the crossli...
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