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High-performance heat-conducting silica gel and preparation method thereof

A thermally conductive silicon and high-performance technology, applied in the field of high-performance thermally conductive silicone gel and its preparation, can solve the problems of reduced protection of components, reduced material elasticity and toughness, etc., to achieve lasting elasticity and toughness, improve heat resistance, Guaranteed quality reliability and service life effect

Active Publication Date: 2017-05-24
GUANGZHOU BAIYUN CHEM IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] During the use of traditional thermally conductive silicone gel, there is an internal hardening phenomenon caused by stress caused by continuous heating and temperature changes, which leads to a decrease in the elasticity and toughness of the material, and greatly reduces the protective effect on components.

Method used

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  • High-performance heat-conducting silica gel and preparation method thereof
  • High-performance heat-conducting silica gel and preparation method thereof
  • High-performance heat-conducting silica gel and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0041] Embodiment 1 high-performance heat-conducting silicone gel

[0042] A high-performance thermally conductive silicone gel of this embodiment, the silicone gel is prepared from component A and component B with a mass ratio of 1:1; the component A:

[0043] Vinyl-terminated silicone oil (vinyl content 0.3wt%) 16g

[0044] Alumina filler (particle size 8 ~ 10um) 84g

[0045] Platinum catalyst (3200ppm) 0.002g

[0046] Described B component is made up of the raw material of following percentage by weight:

[0047]

[0048] The preparation method of a kind of high-performance heat-conducting silicone gel of the present embodiment comprises the following steps:

[0049] 1) Preparation of component A: Mix the base material, heat-conducting filler, and catalyst evenly to obtain the product;

[0050] 2) Preparation of component B: Mix the base material, thermally conductive filler, terminal hydrogen-containing silicone oil, crosslinking agent, and inhibitor uniformly to ob...

Embodiment 2

[0056] Embodiment 2 high-performance heat-conducting silicone gel

[0057] A high-performance thermally conductive silicone gel of this embodiment, the silicone gel is prepared from component A and component B with a mass ratio of 1:1; the component A:

[0058] Vinyl-terminated silicone oil (vinyl content 0.3wt%) 18g

[0059] Alumina filler (particle size 8 ~ 10um) 82g

[0060] Platinum catalyst (3200ppm) 0.002g

[0061] Described B component is made up of the raw material of following percentage by weight:

[0062]

[0063] The preparation method of a kind of high-performance heat-conducting silicone gel of the present embodiment comprises the following steps:

[0064] 1) Preparation of component A: Mix the base material, heat-conducting filler, and catalyst evenly to obtain the product;

[0065]2) Preparation of component B: Mix the base material, thermally conductive filler, terminal hydrogen-containing silicone oil, crosslinking agent, and inhibitor uniformly to obt...

Embodiment 3

[0071] Embodiment 3 high-performance heat-conducting silicone gel

[0072] A high-performance thermally conductive silicone gel of this embodiment, the silicone gel is prepared from component A and component B with a mass ratio of 1:1; the component A:

[0073] Vinyl-terminated silicone oil (vinyl content 0.3wt%) 15g

[0074] Alumina filler (particle size 8-10um) 85g

[0075] Platinum catalyst (3200ppm) 0.002g

[0076] Described B component is made up of the raw material of following percentage by weight:

[0077]

[0078] The preparation method of a kind of high-performance heat-conducting silicone gel of the present embodiment comprises the following steps:

[0079] 1) Preparation of component A: Mix the base material, heat-conducting filler, and catalyst evenly to obtain the product;

[0080] 2) Preparation of component B: Mix the base material, thermally conductive filler, terminal hydrogen-containing silicone oil, crosslinking agent, and inhibitor uniformly to obta...

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Abstract

The invention discloses a high-performance heat-conducting silica gel and a preparation method thereof. The high-performance heat-conducting silica gel is prepared from a component A and a component B in a mass ratio of 1:1. The component A is composed of a base material, a heat-conducting filler and a catalyst. The component B is composed of a base material, a heat-conducting filler, hydrogen-terminated silicon oil, a crosslinking agent and an inhibitor. The crosslinking agent is a loop-structure Si-H-group-containing polymer prepared from hexyl trichlorosilane, dimethylchlorosilane, water, a solvent and a pH regulator. By using the loop-structure Si-H-group-containing polymer to participate in the silicon hydrogenation addition reaction as the crosslinking agent, the prepared heat-conducting silica gel has favorable flowability, is convenient to operate, and has favorable resistance to internal hardening caused by stress due to continuous heating and temperature changes; and the material can maintain durable elasticity and toughness, and ensures the quality reliability and service life of the electronic components.

Description

technical field [0001] The invention belongs to the technical field of silica gel, and more specifically, the invention relates to a high-performance heat-conducting silica gel and a preparation method thereof. Background technique [0002] With the rapid development of science and technology and the electronic industry, electronic components tend to become smaller and smaller, which will inevitably cause the heat generated by the internal device structure to not be easily dissipated in the environment, thereby increasing the temperature of electronic components and affecting its stability. At the same time, the quality of heat dissipation is closely related to the service life and quality reliability of components. The higher the temperature of electronic components, the lower their service life and quality reliability. At present, improving the thermal conductivity of polymers at home and abroad is mainly achieved by adding high thermal conductivity inorganic fillers. T...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/05C08K13/02C08K3/22C08K3/38C08K3/28C08K3/08C09K5/14
CPCC08L83/04C08L2201/08C08L2203/20C08L2205/025C08L2205/035C09K5/14C08K13/02C08K2003/2227C08K2003/2296C08K2003/385C08K2003/282C08K2003/0812
Inventor 杨敦刘光华黄文哲付子恩陈建军
Owner GUANGZHOU BAIYUN CHEM IND
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