Enhancement-mode HEMT (High Electron Mobility Transistor) device capable of inhibiting current collapse effect, and preparation method thereof
A current suppression and enhanced technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, semiconductor devices, etc., can solve the problems that p-type layer growth cannot be realized immediately, so as to suppress the current collapse effect, quickly incorporate, and improve safety sexual effect
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[0061] Further, the preparation method may include: after the third semiconductor layer is grown, isolating the active region of the formed device, and then forming a gate material layer on the third semiconductor layer.
[0062] For example, in a typical embodiment, the preparation method may specifically include:
[0063] providing a substrate;
[0064] epitaxially growing a nitride buffer layer on the substrate;
[0065] epitaxially growing a nitride channel layer on the nitride buffer layer;
[0066] epitaxially growing a nitride barrier layer on the nitride channel layer;
[0067] epitaxially growing a quantum well layer and a p-type nitride layer sequentially on the nitride barrier layer;
[0068] Ion implantation technology is used to isolate the active area, and the ion implantation depth reaches the nitride buffer layer;
[0069] depositing a gate material layer on the p-type nitride layer;
[0070] Etching the non-gate region to expose at least the source region...
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