Epitaxial structure of AlInGaN-based multi-quantum well light-emitting diode
A technology of light-emitting diodes and epitaxial structures, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as difficulty in ensuring the quality of quantum barrier materials, failure to achieve the design effect, and decline in LED efficiency, so as to reduce electron leakage and improve efficiency Dip effect, effect of improving electron-hole matching degree
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Embodiment 1
[0025] This embodiment takes the silicon substrate InGaN / GaN multi-quantum well LED material structure as an example.
[0026] refer to figure 1 . Clean a Si(111) substrate 1; put it into MOCVD to grow an aluminum nitride transition layer 2; grow an N-type gallium nitride 3 with a thickness of 2.4 μm on the aluminum nitride transition layer 2; 9 cycles of In grown on 3 0.16 Ga 0.84 N (3nm thick) / GaN (10nm thick) multi-quantum well light-emitting active layer 4; the structure of the n-1th quantum barrier 404 in the multi-quantum well is as follows image 3 As shown, the thickness of the GaN / AlGaN / GaN layer is 2.5nm / 5nm / 2.5nm, and the Al composition is 20%. An AlGaN electron blocking layer 5 with a thickness of 20 nm and a P-type gallium nitride layer 6 with a thickness of 100 nm are grown successively on the light emitting active layer 4 . The growth process of all layers adopts conventional growth methods.
Embodiment 2
[0028] Compared with Example 1, the AlGaN of the n-1th quantum barrier 404 in the multi-quantum luminescent active layer 4 is changed to AlInGaN, the Al composition is 30%, and the In composition is 10%.
Embodiment 3
[0030] Compared with Example 1, the structure of the n-1th quantum barrier 404 in the multi-quantum light-emitting active layer 4 is as follows image 3 As shown, the thickness of the AlGaN / GaN / AlGaN layer is 3nm / 4nm / 3nm; along the growth direction, the Al composition of the first layer of AlGaN is 20%, and the Al composition of the second layer of AlGaN is 15%.
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