PTFE (polyfluortetraethylene) fiber high-frequency communication circuit board and preparation method thereof

Abstract

The invention discloses a PTFE (polyfluortetraethylene) fiber high-frequency communication circuit board and a preparation method thereof. The PTFE fiber high-frequency communication circuit board is formed by multilayer PTFE screen cloth and PTFE membranes through mutual interval superposed arrangement. The PTFE fiber high-frequency communication circuit board has the advantages that the PTFE dielectric constant is low; the insulation performance is good; the signal loss is low; the anti-corrosion performance is good; good rigidity and intensity are realized; the stability is good; the length change rate is smaller than or equal to 5 percent at the temperature of -50 DEG C to 250 DEG C; the high-frequency communication application occasions such as spaceflight can be completely met.

Description

technical field [0001] The invention relates to a circuit board, more specifically a polytetrafluoroethylene fiber high-frequency communication circuit board and a preparation method thereof. Background technique [0002] At present, common printed circuit boards for communication are generally epoxy material circuit boards or glass fiber material circuit boards. Due to the high dielectric constant of epoxy material and glass fiber material, epoxy material is 3-3.5, glass fiber material is 3.5-4, the signal loss is relatively large, and some high-frequency communication circuit boards The application temperature is between -50° and 250° (such as space), and it needs to have excellent stability. At present, the circuit boards made of the above two types of materials are obviously not suitable for high-end high-frequency communication fields. Contents of the invention [0003] The object of the present invention is to address the above defects, and propose a polytetrafluoro...

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Problems solved by technology

[0002] At present, common printed circuit boards for communication are generally epoxy material circuit boards or glass fiber material circuit boards. Due to the high dielectric constant of epoxy material and glass fiber material, epoxy material is 3-3.5, glass fiber material is 3.5-4, the signal loss is relatively large, and some high-frequency communication circuit boards The application temperature is between -50° and 250° (such as space), and it needs to have excellent stability. At present, the circuit boards made of the above two types of materials are obviously not suitable for high-end high-frequency communication fields.

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