Discharging rapid consolidation method and device for Ti cutting recycling and reproducing

A technology of recycling chips, which is applied in the field of metal material processing, can solve the problems of intensified oxidation of Ti chips, microstructure metallurgical defects, etc., and achieve short consolidation period, high consolidation pressure and high production efficiency Effect

Inactive Publication Date: 2017-06-13
SHANGHAI DIANJI UNIV
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

However, the existing powder metallurgy technology has many process steps and long process (sintering) cycle
During the long-term high-temperature consolidation process, Ti chips will intensify oxidation, resulting in the formation of serious metallurgical defects in the microstructure, weakening the material properties
At present, this technical problem has not been well resolved

Method used

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  • Discharging rapid consolidation method and device for Ti cutting recycling and reproducing
  • Discharging rapid consolidation method and device for Ti cutting recycling and reproducing

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Embodiment Construction

[0026] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further elaborated below in conjunction with illustrations and specific embodiments.

[0027] Such as figure 1 As shown, a kind of discharge rapid consolidation method of titanium swarf recycling remanufacturing that the present invention proposes, comprises the following steps:

[0028] Step (1)-Ti cutting recovery pretreatment: use the chips generated by end milling Ti 2 (ASTM Grade 2) as raw materials, collect the chips, and use Inductively coupled plasma atomic emission spectroscopy (ICP for short) -AES) analyzes its chemical composition (mass percentage, wt.%), and analysis result is as follows: initial Ti cutting (mass percentage, wt.%) O=0.15, N<0.01, C<0.01, Fe=0.10; By analysis result It can be seen that the chemical composition (oxygen content) of the grade 2 Ti chips processed by milling meets the ASTM...

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Abstract

The invention provides a rapid consolidation method and device for Ti cutting recycling and reproducing. The method includes the following steps that (1) -Ti cuttings are subjected to recovery pretreatment; (2) the -Ti cuttings are dried and degassed; (3) the -Ti cuttings are subjected to cold-pressed pretreatment; and (4) -Ti cutting cold-pressed blanks are subjected to high-density current rapid consolidation. According to the Ti cutting high-density current rapid consolidation and reproduction method provided by the invention, high-temperature casting is avoided, and the method is a low-cost and efficient cleaning metal resource recovery processing technology and suitable for carrying out circulation and recycling of high-smelting-cost metal resources represented by Ti.

Description

technical field [0001] The invention relates to the field of metal material processing, and relates to the solid-phase recycling and reuse of waste metal resources, especially for titanium resources with high smelting costs, and develops a new technology for remanufacturing highly efficient and clean titanium chips. Background technique [0002] At present, the powder metallurgy technologies developed for solidifying powder materials mainly include hot-pressing sintering (HPS for short), spark plasma sintering (SPS for short), and high-pressure and high-temperature sintering (High-pressure and high-temperature sintering). temperature sintering, referred to as HPHTS) and so on. HPS technology is widely used in the preparation of metal matrix composites. For example, Lim et al published "Wear behavior of SiCp-reinforced magnesium matrix composites (magnesium-based SiC particle reinforced composite Wear behavior of materials)", using Mg, Al and SiC powders as raw materials, af...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F8/00B22F3/02B22F3/14
CPCB22F3/02B22F3/14B22F8/00Y02W30/50
Inventor 罗蓬
Owner SHANGHAI DIANJI UNIV
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