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Flux composition and solder paste

A technology of composition and flux, which is applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problems such as the reduction of insulation resistance of flux residues, and achieve the effect of suppressing the reduction of insulation resistance

Pending Publication Date: 2017-06-13
TAMURA KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the activator remains in the above-mentioned flux residue, especially when the mounting substrate using it is placed under high temperature and high humidity, there arises a problem that the residual activator contained therein is generated due to the moisture absorption of the flux residue. Ionizes, thus reducing the insulation resistance of flux residues

Method used

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  • Flux composition and solder paste
  • Flux composition and solder paste
  • Flux composition and solder paste

Examples

Experimental program
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Embodiment

[0100] Hereinafter, the present invention will be described in detail with reference to Examples and Comparative Examples. In addition, this invention is not limited to these Examples.

[0101] Each component described in Table 1 was kneaded to obtain each flux composition. Then, 11.50% by weight of each of these flux compositions and 88.50% by weight of Sn-3Ag-0.5Cu solder alloy powder (average particle diameter: 28 μm) were mixed to prepare the respective solder pastes of Examples 1 and 2 and Comparative Examples 1 and 2. .

[0102] It should be noted that, unless otherwise specified, the numerical values ​​described in Table 1 mean % by weight.

[0103] In addition, the thixotropic agents used in Examples (1 and 2) and Comparative Examples 1 and 2 were measured using pyrolysis gas chromatography mass spectrometry under the following measurement conditions. Its gas chromatogram is shown in figure 2 .

[0104] (sample)

[0105] 0.3mg

[0106] (pyrolysis)

[0107] Pyr...

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Abstract

To provide a flux composition and a solder paste which can suppress decrease in the insulation resistance of flux residues without reducing in an amount of blended activator. A flux composition comprises (A) rosin-based resin, (B) solvent, (C) activator and (D) thixotropic agent, the thixotropic agent (D) comprising a thixotropic agent having (D-1) fatty acid polyamide structure, with the fatty acid having a C12-22 long-chain alkyl group.

Description

technical field [0001] The present invention relates to a flux composition used when soldering electrodes formed on substrates such as printed circuit boards and silicon wafers to electronic components and the like, and a solder paste using the same. Background technique [0002] In the past, in order to remove metal oxides on the substrate and / or improve wettability by lowering the surface tension of the solder alloy powder, together with the solder alloy powder in the solder paste used for mounting electronic components on the substrate, A flux composition is compounded. Also, generally, the flux composition contains an activator for suppressing the formation of the above-mentioned metal oxide and a thixotropic agent for adjusting viscosity. [0003] With this flux composition, after mounting electronic components on a substrate, it remains in the form of flux residues adhering to the solder joint and its vicinity, such as on the substrate, terminals and lead frames of el...

Claims

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Application Information

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IPC IPC(8): B23K35/363B23K35/26
CPCB23K35/262B23K35/3613B23K2101/42H05K3/3489H05K3/3457B23K35/3612B23K1/0016
Inventor 大年洋司
Owner TAMURA KK
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