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Novel structure for transferring suspended microstrip line to microstrip line

A technology of transition structure and microstrip line, which is applied in the direction of connection devices, waveguide devices, electrical components, etc., can solve the problems of difficult processing and large insertion loss, and achieve the advantages of convenient processing and production, reduced insertion loss, and reduced production cost Effect

Active Publication Date: 2017-06-13
BEIJING RES INST OF TELEMETRY +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem solved by the present invention is to provide a new bottom semi-arc transition structure + top transmission line in order to overcome the shortcomings of the existing suspended microstrip line to microstrip line transition technology, such as excessive insertion loss and difficult processing. Wide transition structure to achieve excellent performance of broadband and low insertion loss

Method used

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  • Novel structure for transferring suspended microstrip line to microstrip line
  • Novel structure for transferring suspended microstrip line to microstrip line

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Experimental program
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Embodiment

[0029] Select Rogers 5880 with a dielectric constant of 2.2 and a substrate thickness of 0.127mm. The microstrip line width is 0.38mm. The air cavity is at the bottom of the suspended microstrip line, the width is the same as the suspended microstrip line width of 2mm, the chamfering radius is 1mm, and the depth is 1mm. The length of the transition section of the top transmission line is 0.65mm, and the width after transition is 0.2mm. The semi-arc transition radius on the back is 1.45mm, the width is 2mm, the length is 1.9mm, and the groove width is 0.28mm.

[0030] The specific size of the structure optimized by electromagnetic simulation is:

[0031] (1) The length of the top metal transmission line 1 is 8mm, the width is 0.38mm, the length of the transition section is 0.65mm, and the width after transition is 0.2mm;

[0032] (2) The length of the dielectric substrate 2 is 8mm, the width is 2mm, and the height is 0.127mm;

[0033] (3) The chamfering radius of bottom sem...

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Abstract

The invention discloses a novel structure for transferring a suspended microstrip line to a microstrip line. The structure comprises a dielectric substrate, a top layer transmission line, a subbing layer printed image and a bottom air-filled cavity, wherein the top layer of the dielectric substrate is printed with the top layer transmission line, the top layer transmission line comprises a microstrip section, a transition section and a suspended microstrip section, the axial length of the transition section is 0.5-0.65 mm, and the width of the microstrip section is 1.9-2 folds that of the suspended microstrip section; the subbing layer of the dielectric substrate is printed with the subbing layer printed image. The novel structure is simple in structure, convenient to process and manufacture, the production cost is reduced, and the novel transition structure is applicable to all kinds of microwave and millimeter wave integrated circuit transmission structures.

Description

technical field [0001] The invention relates to a novel transition structure from a suspended microstrip line to a microstrip line, which is suitable for planar transmission of radio frequency circuits in the millimeter wave frequency band, especially millimeter wave circuit transmission with a frequency higher than 60 GHz. Background technique [0002] With the wide application of wireless communication systems and radar systems in the millimeter-wave frequency band, the decline in system indicators caused by the insertion loss of transmission lines is particularly prominent. The bottom of the suspended microstrip line is not in contact with the metal and is suspended in the structure. Therefore, the dispersion is small in high-frequency transmission, and the loss when transmitting signals is significantly improved compared with the insertion loss value of the microstrip line. The chip in the traditional MCM circuit needs to be connected to the microstrip transmission line....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P5/08
CPCH01P5/08
Inventor 赵明刘德喜
Owner BEIJING RES INST OF TELEMETRY