Cavity equipment convenient to radiate

Abstract

The invention discloses cavity equipment convenient to radiate. The cavity equipment comprises a cavity body; a concave cavity is formed in the upper surface of the cavity body; the cavity body is of an integrated structure; a first groove is formed in each of the left outer side surface and the right outer side surface of the cavity body separately; a plurality of heat dissipation sheets are arranged in the first grooves; a plurality of second grooves are also formed in each of the left outer side surface and the right outer side surface of the cavity body separately; and the second grooves and the first grooves are not crossed. By virtue of the integrated cavity equipped with heat dissipation grooves, one-time packaging and forming of a microwave circuit can be realized, production processes can be reduced, the heat dissipation area can be enlarged, and operating reliability of electronic elements can be improved.

Description

technical field [0001] The invention relates to a cavity device, in particular to a cavity device that facilitates heat dissipation. Background technique [0002] A microwave circuit is a circuit that operates in the microwave and millimeter wave bands and is integrated on a substrate by microwave passive components, active devices, transmission lines and interconnection lines, and has certain functions. Microwave circuits are mostly microwave integrated circuits. Microwave integrated circuits can be divided into hybrid microwave integrated circuits and monolithic microwave integrated circuits. Hybrid microwave integrated circuits use thin-film or thick-film technology to make passive microwave circuits on substrates suitable for transmitting microwave signals. The functional blocks and circuits are designed and manufactured according to the needs of the system. Commonly used hybrid microwave integrated circuits include various broadband microwave circuits such as microstrip...

AI Technical Summary

Problems solved by technology

[0005] Most of the existing shells are assembled structures, which are not only inconvenient to assemble, but also the joints of the components are not well stressed, and cannot play a good role in sealing, mechanical support and physical protection; in addition, the existing metal packaging shells generally have heat dissipation. Not good, the surface temperature is too high, and the continuous high temperature will cause irreversible damage to the electronic components inside the package

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