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Cavity equipment convenient to radiate

A cavity and equipment technology, applied in the construction parts of electrical equipment, electrical equipment housing/cabinet/drawer, cooling/ventilation/heating transformation, etc., can solve the problem of metal packaging that cannot play the role of sealing, mechanical support and physical protection Problems such as poor heat dissipation of the shell and poor stress on the joints of the components have achieved the effects of lowering the temperature, enhancing the structural strength, and reducing the production process

Inactive Publication Date: 2017-06-20
SICHUAN LAIYUAN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Most of the existing shells are assembled structures, which are not only inconvenient to assemble, but also the joints of the components are not well stressed, and cannot play a good role in sealing, mechanical support and physical protection; in addition, the existing metal packaging shells generally have heat dissipation. Not good, the surface temperature is too high, and the continuous high temperature will cause irreversible damage to the electronic components inside the package

Method used

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  • Cavity equipment convenient to radiate
  • Cavity equipment convenient to radiate

Examples

Experimental program
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Embodiment

[0026] Such as figure 1 with figure 2 As shown, this embodiment provides a cavity device that facilitates heat dissipation. A concave cavity 1 is provided on the upper surface of the cavity body. The cavity body is an integrated structure. The left and right outer sides of the cavity body are respectively provided with There is a first groove 2, and a plurality of cooling fins 3 are arranged in the first groove 2; a plurality of second grooves 4 are respectively arranged on the left outer surface and the right outer surface of the cavity body, and the second groove 4 It does not intersect with the first groove 2; the lower surface of the cavity body is arc-shaped, and the lower surface of the cavity body is provided with a plurality of second grooves 4; in addition, the first groove 2, the heat sink 3 and the second The surfaces of the grooves 4 are all coated with heat-dissipating paint.

[0027] The front side of the cavity body is provided with a first round hole 5 and a...

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Abstract

The invention discloses cavity equipment convenient to radiate. The cavity equipment comprises a cavity body; a concave cavity is formed in the upper surface of the cavity body; the cavity body is of an integrated structure; a first groove is formed in each of the left outer side surface and the right outer side surface of the cavity body separately; a plurality of heat dissipation sheets are arranged in the first grooves; a plurality of second grooves are also formed in each of the left outer side surface and the right outer side surface of the cavity body separately; and the second grooves and the first grooves are not crossed. By virtue of the integrated cavity equipped with heat dissipation grooves, one-time packaging and forming of a microwave circuit can be realized, production processes can be reduced, the heat dissipation area can be enlarged, and operating reliability of electronic elements can be improved.

Description

technical field [0001] The invention relates to a cavity device, in particular to a cavity device that facilitates heat dissipation. Background technique [0002] A microwave circuit is a circuit that operates in the microwave and millimeter wave bands and is integrated on a substrate by microwave passive components, active devices, transmission lines and interconnection lines, and has certain functions. Microwave circuits are mostly microwave integrated circuits. Microwave integrated circuits can be divided into hybrid microwave integrated circuits and monolithic microwave integrated circuits. Hybrid microwave integrated circuits use thin-film or thick-film technology to make passive microwave circuits on substrates suitable for transmitting microwave signals. The functional blocks and circuits are designed and manufactured according to the needs of the system. Commonly used hybrid microwave integrated circuits include various broadband microwave circuits such as microstrip...

Claims

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Application Information

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IPC IPC(8): H05K5/06H05K7/20
CPCH05K5/065H05K7/20409H05K7/20427
Inventor 阳安源
Owner SICHUAN LAIYUAN TECH CO LTD
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