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PCB character process

A PCB board and text technology, applied in the field of PCB text technology, can solve problems such as product quality does not have a competitive advantage, and achieve the effects of avoiding poor welding, reducing heating time, and reducing waste gas treatment costs

Inactive Publication Date: 2017-07-18
PLOTECH TECH KUNSHAN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, this traditional method has no competitive advantage in terms of processing time, energy costs, or even product quality.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0020] A kind of PCB text process, the steps include in sequence:

[0021] ①Solder mask development: remove unnecessary solder mask ink at the window opening of the solder mask;

[0022] ② Printing on side A: Print the required characters on the front side of the PCB board;

[0023] ③Baking on side A: Bake the PCB board for 15 minutes in a high temperature environment of 70-155 °C to make the text ink on the front of the PCB board semi-cured;

[0024] ④ Printing on side B: Print the required characters on the reverse side of the PCB board;

[0025] ⑤ Solder mask baking: Bake the PCB board for 210 minutes in a high temperature environment of 70 ~ 155 ℃, so that the solder mask ink on the PCB board is completely cured;

[0026] ⑥ Cutting and forming: Cut the PCB board into the size of the shipping piece through the forming machine.

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PUM

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Abstract

The invention belongs to the technical field of printed circuit board manufacture, and relates to a PCB character process. The PCB character process comprises the steps of soldering resisting developing, A-surface printing, A-surface baking, B-surface printing, soldering resisting baking and cutting molding. Compared with prior art, the PCB character process has advantages of reducing a technological flow, reducing production time, realizing remarkable delivery time advantage, reducing heating time, reducing energy consumption, reducing exhaust processing cost, satisfying a low-carbon development requirement, preventing defective welding caused by pollution in multiple time of board baking, and improving product reliability.

Description

technical field [0001] The invention relates to the technical field of printed circuit board manufacturing, in particular to a more energy-saving PCB writing process. Background technique [0002] In the manufacture of PCB or multi-layer PCB, sometimes mimeographed characters are encountered on the front and back of the board. The usual steps of this double-sided text process are solder mask development → solder mask baking → printing on side A of text → baking on side A of text → printing on side B of text → baking on side B of text → cutting and forming. The baking of the text on the A side is only to make the ink slightly bright and dry, so as to avoid the anti-sticking of the table when printing the text on the B side, so the baking time is shorter, and the baking of the B side text is to completely cure the A / B text ink, so the B side text High energy consumption and more baking times will affect the cleanliness of solder mask pads and cause soldering defects. Therefo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/22H05K3/28
CPCH05K3/22H05K3/282H05K2203/1476
Inventor 赖荣祥
Owner PLOTECH TECH KUNSHAN CO LTD
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